Inventor
JOHN R. DANGLER
Inventor
US
Overview
Patents· 42 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits19%
G06FElectric digital data processing8%
H01RElectrically-conductive connections8%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
G01RMeasuring electric variables7%
H01LSemiconductor devices7%
B23KSoldering or unsoldering5%
G01NInvestigating or analysing materials by determining their chemical or physical properties4%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact2%
G01BMeasuring length, thickness or similar linear dimensions2%
PatentTitleYear
12,590,844Thermographic imaging for quality analysis202612,535,537Leakage characterization for electronic circuit temperature monitoring202612,436,874Computer system test parallelization202512,414,229Tearing security feature of printed circuit substrates202512,355,127Field-adjustable flex circuit transmission line filters202512,258,020Intelligent advanced engine braking system202512,256,494Modified internal clearance(s) at connector pin aperture(s) of a circuit board202512,174,240Ball grid array current meter with a current sense wire202412,117,420Sonar scanning water cooled coaxial cables202412,100,910Shape-memory alloy lock for connectors202412,051,870Cryogenic chamber connector202412,004,307Short or near short etch rework202411,991,277Cryptographic hardware security module with secure embedded heat pipe202411,963,307Vacuum-assisted BGA joint formation202411,948,807Feature selection through solder-ball population202411,929,390Temperature-dependent capacitor202411,906,574Hybrid socket warp indicator202411,742,602Press-fit rework method202311,733,154Thermal interface material detection through compression202311,699,884Electromagnetic shielding of heatsinks with spring press-fit pins202311,647,591Compliant pin surface mount technology pad for rework202311,641,717Soldering of end chip components in series202311,614,497Leakage characterization for electronic circuit temperature monitoring202311,555,793Anti-vibration fixturing system for nondestructive testing202311,538,638Co-axial grid array capacitor assembly202211,519,957Ball grid array current meter with a current sense wire202211,493,565Leakage characterization and management for electronic circuit enhancement202211,488,571Anti-eavesdrop security device202211,445,650Localized rework using liquid media soldering202211,424,562Press-fit insertion method202211,382,210Dielectric material change to optimize electrical and mechanical properties of flex circuit202211,330,347Dynamically optimized stoppage time media content202211,300,605Printed circuit board performance evaluation techniques202211,268,809Detecting and correcting deficiencies in surface conditions for bonding applications202211,262,776Modifying regulator output voltage with a peltier device202211,245,238Tool for shaping contact tab interconnects at a circuit card edge202211,235,625Implementing tire tread depth and wear patterns monitoring with RFID202211,226,369Ball grid array current meter with a current sense loop202211,211,760Stutter step press-fit connector insertion process202111,205,016Secure crypto module including optical security pathway202111,175,100Heat sinks using memory shaping materials202111,147,158Tamper-respondent assembly with interconnect characteristic(s) obscuring circuit layout2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to IBM (42)· patent assignee history
2021–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 42 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 42 | 2021–2026 |