Inventor
Xinrong LI
Inventor
JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices31%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
H05KPrinted circuits15%
PatentTitleYear
12,463,191Method for manufacturing electronic component device and electronic component device202512,315,760Method for manufacturing electronic component device202512,218,019Method for manufacturing electronic component device, and electronic component device202512,183,686Method for producing electronic component device and laminated film used therefor2024Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2024–2025Patents assigned to RESONAC CORP (4)· patent assignee history
2024–2025Patents assigned to SHOWA DENKO MATERIALS CO LTD (4)· patent assignee history
2024–2025Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| RESONAC CORP | 4 | 2024–2025 |
| SHOWA DENKO MATERIALS CO LTD | 4 | 2024–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 4 | 2024–2025 |