Inventor
SHIH-KANG FU
Inventor
TW
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices32%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
H10DInorganic electric semiconductor devices13%
C09GPolishing compositions3%
PatentTitleYear
12,362,233Methods of performing chemical-mechanical polishing process in semiconductor devices202512,342,600Titanium-containing diffusion barrier for CMP removal rate enhancement and contamination reduction202512,205,886Hybrid method for forming semiconductor interconnect structure202511,810,816Chemical mechanical polishing topography reset and control on interconnect metal lines202311,742,239Methods of performing chemical-mechanical polishing process in semiconductor devices202311,545,389Titanium-containing diffusion barrier for CMP removal rate enhancement and contamination reduction202311,450,602Hybrid method for forming semiconductor interconnect structure202211,342,219Chemical mechanical polishing topography reset and control on interconnect metal lines202211,211,256Method with CMP for metal ion prevention202111,152,255Methods of performing chemical-mechanical polishing process in semiconductor devices2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (10)· patent assignee history
2021–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 10 | 2021–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 10 | 2021–2025 |