Inventor
Hirotoshi Maeda
Inventor
Yokohama, JP
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C08Gprimary
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds22%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices20%
H05KPrinted circuits9%
C08LCompositions of macromolecular compounds7%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%
B60RVehicles, vehicle fittings, or vehicle parts, not otherwise provided for4%
G03CPhotosensitive materials for photographic purposes4%
B41FPrinting machines or presses2%
B41PIndexing scheme relating to printing, lining machines, typewriters, and to stamps2%
C07CAcyclic or carbocyclic compounds2%
PatentTitleYear
11,021,993Thermal insulation coating member, axial flow turbine, and method for producing thermal insulation coating member202110,903,703Rotor, rotating electrical machine and production method of cover tube202110,442,372Vehicle-mounted power distribution board, electrical junction box, and charging/discharging controller201910,448,497Circuit assembly and electrical junction box201910,297,998Electrical junction box20199,579,876'Printing mechanism'20176,664,021'Photosensitive polymide precursor resin composition'20035,449,705'Silicon-containing polyamic acid derivative and photosensitive resin composition using it'19955,449,588'Photosensitive polyimide precursor composition with photoacid generator'19955,442,024'Photosensitive polyimide precursor composition'19955,342,739'Method of preparing a negative pattern utilizing photosensitive polymer composition containing quinonediazide compound and a poly(amido)imide precursor'19945,326,792'Polyimide photosensitive cover coating agent'19945,320,935'Method of forming a pattern from a photosensitive heat-resistant poly(amide)imide having hydroxyphenyl groups'19945,298,359'Photosensitive heat-resistant polymer having hydroxyphenyl group for forming a patterned image'19945,294,696'Process for producing polyisoimide'19945,055,549'Process for preparing photosensitive heat-resistant polymer'19915,026,788'Photosensitive polymer having thiol group'19915,025,088'Photosensitive poly(amide)imide heat-resistant polymer'19914,904,758'Low-melting polyimide copolymer and method for preparing the same'1990Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1990–2003Patents assigned to CHISSO CORP (13)· patent assignee history
1990–2021Based in Yokohama, JP· patent location history
1994–1995Based in Kanagawa, JP· patent location history
2019Patents assigned to AUTONETWORKS TECHNOLOGIES LTD (3)· patent assignee history
2019Patents assigned to SUMITOMO ELECTRIC INDUSTRIES (3)· patent assignee history
2019Patents assigned to SUMITOMO WIRING SYSTEMS (3)· patent assignee history
2019Based in Mie, JP· patent location history
2019Based in Yokkaichi, JP· patent location history
2021Patents assigned to FANUC CORP (1)· patent assignee history
2021Based in Yamanashi, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| CHISSO CORP | 13 | 1990–2003 |
| AUTONETWORKS TECHNOLOGIES LTD | 3 | 2019 |
| SUMITOMO ELECTRIC INDUSTRIES | 3 | 2019 |
| SUMITOMO WIRING SYSTEMS | 3 | 2019 |
| FANUC CORP | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Yokohama, JP | 8 | 1990–2021 |
| Kanagawa, JP | 5 | 1994–1995 |
| Mie, JP | 2 | 2019 |
| Yamanashi, JP | 1 | 2021 |
| Yokkaichi, JP | 1 | 2019 |