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Inventor

Kai-Po Chang

Inventor
Taipei, TW

Overview

4→
Patents
2008–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits27%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
G06FElectric digital data processing9%
H01LSemiconductor devices9%
H10BElectronic memory devices9%
H10DInorganic electric semiconductor devices9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
PatentTitleYear
10,886,222Via contact, memory device, and method of forming semiconductor structure202110,602,639Extension portion of heatsink above a processing component20207,554,809'Heatsink assembly structure'20097,468,888'Heatsink assembly structure'2008

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2008–2009Patents assigned to INVENTEC CORP (2)· patent assignee history
2008–2020Based in Taipei, TW· patent location history
2020Patents assigned to HEWLETT PACKARD ENTPR DEV LP (1)· patent assignee history
2021Patents assigned to MACRONIX INT CO LTD (1)· patent assignee history
2021Based in Zhubei City, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INVENTEC CORP22008–2009
HEWLETT PACKARD ENTPR DEV LP12020
MACRONIX INT CO LTD12021
Locations
LocationPatentsSpan
Taipei, TW32008–2020
Zhubei City, TW12021