Inventor

Cheng Luo

Inventor

Dearborn Heights, MI, US

Overview

2014–2021

Patent span

Performing operations

Primary field (CPC B)

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B62Dprimary

B62DMotor vehicles33%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form8%

B60KArrangement or mounting of propulsion units or of transmissions in vehicles8%

B60YIndexing scheme relating to aspects cross-cutting vehicle technology8%

G06FElectric digital data processing8%

G11BInformation storage based on relative movement between record carrier and transducer8%

H01FMagnets8%

H04LTransmission of digital information, e.g. telegraphic communication8%

Y10TTechnical subjects covered by former us classification8%

PatentTitleYear

Assembled from patent assignee/location history and declaration credentials.

2014Patents assigned to SAE TECHNOLOGIES DELEVOPMENT DONGGUAN CO LTD (1)· patent assignee history

2014Patents assigned to SAE TECHNOLOGIES DEV DONGGUAN CO LTD (1)· patent assignee history

2014Based in Guangdong, CN· patent location history

2017–2018Patents assigned to FORD GLOBAL TECH LLC (4)· patent assignee history

2017–2018Based in Dearborn Heights, MI, US· patent location history

2021Patents assigned to IBM (1)· patent assignee history

2021Patents assigned to REALTEK SEMICONDUCTOR CORP (1)· patent assignee history

2021Based in Hsin Chu, TW· patent location history

2021Based in Beijing, CN· patent location history

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
FORD GLOBAL TECH LLC	4	2017–2018
IBM	1	2021
REALTEK SEMICONDUCTOR CORP	1	2021
SAE TECHNOLOGIES DELEVOPMENT DONGGUAN CO LTD	1	2014
SAE TECHNOLOGIES DEV DONGGUAN CO LTD	1	2014

Locations