Inventor

LinLin Chen

Inventor

Plano, TX, US

Overview

2001–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 50 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%

C25DProcesses for the electrolytic or electrophoretic production of coatings17%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%

H05KPrinted circuits6%

C23CCoating metallic material4%

G06FElectric digital data processing4%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%

Y10TTechnical subjects covered by former us classification4%

A61KPreparations for medical, dental or toiletry purposes3%

C12NMicroorganisms or enzymes3%

PatentTitleYear

11,011,584Array substrate and fabricating method thereof, and display device2021 10,997,476Automated content evaluation using a predictive model2021 10,979,354Signal transmission method and apparatus2021 10,969,624Backlight module and display device2021 10,954,600Electroplating systems and methods2021 10,959,143Communication connection control method, and device2021 10,949,191Patch-upgrade-based file processing method and apparatus, terminal, and storage medium2021 10,936,121Method and device for controlling in-plane interference of liquid crystal touch screen, and display system2021 10,937,444End-to-end neural network based automated speech scoring2021 10,930,893Organic light-emitting diode device, manufacturing method thereof, and display device2021 10,916,662Oxide thin film transistor, array substrate, and preparation methods thereof2021 10,896,007Workload balancing in a distributed storage system2021 10,884,051Line detecting tool and line detecting method for light emitting diode substrate2021 D0828342Smart home hub2018 7,462,269'Method for low temperature annealing of metallization micro-structures in the production of a microelectronic device'2008 7,332,066'Apparatus and method for electrochemically depositing metal on a semiconductor workpiece'2008 7,198,705'Plating-rinse-plating process for fabricating copper interconnects'2007 7,144,805'Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density'2006 7,135,404'Method for applying metal features onto barrier layers using electrochemical deposition'2006 7,115,196'Apparatus and method for electrochemically depositing metal on a semiconductor workpiece'2006 7,067,015'Modified clean chemistry and megasonic nozzle for removing backside CMP slurries'2006 7,048,841'Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces'2006 7,001,471'Method and apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device'2006 6,998,275'Hydrogen-less CVD TiN process for FeRAM VIA0 barrier application'2006 6,994,776'Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic device'2006 6,939,448'Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces'2005 6,932,892'Apparatus and method for electrolytically depositing copper on a semiconductor workpiece'2005 6,919,013'Apparatus and method for electrolytically depositing copper on a workpiece'2005 6,911,127'Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces'2005 6,908,851'Corrosion resistance for copper interconnects'2005 6,899,805'Automated chemical management system executing improved electrolyte analysis method'2005 6,869,510'Methods and apparatus for processing the surface of a microelectronic workpiece'2005 6,811,675'Apparatus and method for electrolytically depositing copper on a semiconductor workpiece'2004 6,806,186'Submicron metallization using electrochemical deposition'2004 6,743,719'Method for forming a conductive copper structure'2004 6,730,597'Pre-ECD wet surface modification to improve wettability and reduced void defect'2004 6,699,373'Apparatus for processing the surface of a microelectronic workpiece'2004 6,645,356'Methods and apparatus for processing the surface of a microelectronic workpiece'2003 6,638,410'Apparatus and method for electrolytically depositing copper on a semiconductor workpiece'2003 6,632,345'Apparatus and method for electrolytically depositing a metal on a workpiece'2003 6,565,729'Method for electrochemically depositing metal on a semiconductor workpiece'2003 6,527,925'Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces'2003 6,508,920'Apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device'2003 6,309,524'Methods and apparatus for processing the surface of a microelectronic workpiece'2001 6,309,520'Methods and apparatus for processing the surface of a microelectronic workpiece'2001 6,306,276'Aqueous electrodeposition of rare earth and transition metals'2001 6,303,010'Methods and apparatus for processing the surface of a microelectronic workpiece'2001 6,290,833'Method for electrolytically depositing copper on a semiconductor workpiece'2001 6,277,263'Apparatus and method for electrolytically depositing copper on a semiconductor workpiece'2001 6,197,181'Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001–2008Patents assigned to SEMITOOL INC (29)· patent assignee history

2001–2008Based in Kalispell, MT, US· patent location history

2003–2008Based in Plano, TX, US· patent location history

2004–2007Patents assigned to TEXAS INSTRUMENTS INC (6)· patent assignee history

2018–2021Based in Shenzhen, CN· patent location history

2021Patents assigned to BOE TECHNOLOGY GROUP CO LTD (5)· patent assignee history

2021Patents assigned to HUAWEI TECH CO LTD (3)· patent assignee history

2021Patents assigned to BEIJING BOE OPTOELECTRONICS TECH CO LTD (2)· patent assignee history

2021Based in Beijing, CN· patent location history

2021Based in Burnaby, CA· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
SEMITOOL INC	29	2001–2008
TEXAS INSTRUMENTS INC	6	2004–2007
BOE TECHNOLOGY GROUP CO LTD	5	2021
HUAWEI TECH CO LTD	3	2021
BEIJING BOE OPTOELECTRONICS TECH CO LTD	2	2021

Locations

Location	Patents	Span
Plano, Texas, US	20	2003–2008
Kalispell, MT, US	16	2001–2008
Beijing, CN	6	2021
Shenzhen, CN	3	2018–2021
Burnaby, CA	1	2021