Inventor
Fuad E. Doany
Inventor
Katonah, NY, US
Overview
Patents· 93 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G02Bprimary
G02BOptical elements, systems or apparatus20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
H04NPictorial communication, e.g. television8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
Y10TTechnical subjects covered by former us classification8%
H05KPrinted circuits6%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein4%
H01LSemiconductor devices4%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices3%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light3%
PatentTitleYear
10,937,671Conductive heat spreader and heat sink assembly for optical devices202110,749,817High-density, fail-in-place switches for computer and data networks202010,486,268Damage-free self-limiting through-substrate laser ablation201910,389,654High-density, fail-in-place switches for computer and data networks201910,282,646Tag with tunable retro-reflectors201910,269,592Conductive heat spreader and heat sink assembly for optical devices20199,989,702Polarization rotator for silicon photonics20189,915,784'Optical waveguide structure with waveguide coupler to facilitate off-chip coupling'20189,818,054'Tag with tunable retro-reflectors'20179,817,193'Through-substrate optical coupling to photonics chips'20179,738,560'Controlling fragmentation of chemically strengthened glass'20179,735,879'Near-threshold optical transmitter pre-distortion'20179,671,563'Through-substrate optical coupling to photonics chips'20179,634,959'High-density, fail-in-place switches for computer and data networks'20179,608,761'Realizing coarse wavelength-division multiplexing using standard multimode optical fibers'20179,586,857'Controlling fragmentation of chemically strengthened glass'20179,584,225'Realizing coarse wavelength-division multiplexing using standard multimode optical fibers'20179,576,836'Damage-free self-limiting through-substrate laser ablation'20179,568,679'Lens array optical coupling to photonic chip'20179,411,106'Polarization-independent grating coupler for silicon on insulator'20169,322,987'Multicore fiber coupler between multicore fibers and optical waveguides'20169,285,554'Through-substrate optical coupling to photonics chips'20169,229,169'Lens array optical coupling to photonic chip'20169,103,972'Optical waveguide structure with waveguide coupler to facilitate off-chip coupling'20159,091,819'Grating edge coupler and method of forming same'20159,057,844'Grating edge coupler and method of forming same'20158,901,576'Silicon photonics wafer using standard silicon-on-insulator processes through substrate removal or transfer'20148,692,276'Parallel optical transceiver module'20148,674,766'Differential amplifier stage with integrated offset cancellation circuit'20148,601,677'Optical alignment module utilizing transparent reticle to facilitate tool calibration during high temperature process'20138,536,610'Parallel optical transceiver module'20138,488,921'Packaged multicore fiber optical transceiver module'20138,482,352'Differential amplifier stage with integrated offset cancellation circuit'20138,456,240'Differential amplifier stage with integrated offset cancellation circuit'20138,399,292'Fabricating a semiconductor chip with backside optical vias'20138,265,432'Optical transceiver module with optical windows'20128,231,284'Ultra-high bandwidth, multiple-channel full-duplex, single-chip CMOS optical transceiver'20128,176,624'Optical alignment module utilizing transparent reticle to facilitate tool calibration during high temperature process'20128,002,477'Devices and methods for side-coupling optical fibers to optoelectronic components'20117,755,159'DUV laser annealing and stabilization of SiCOH films'20107,560,794'DUV laser annealing and stabilization of SiCOH films'20097,539,366'Optical transceiver module'20097,496,251'Apparatus and methods for integrally packaging optoelectronic devices, IC chips and optical transmission lines'20097,440,668'Devices and methods for side-coupling optical fibers to optoelectronic components'20087,336,863'Apparatus and methods for integrally packaging optoelectronic devices, IC chips and optical transmission lines'20087,223,670'DUV laser annealing and stabilization of SiCOH films'20077,116,886'Devices and methods for side-coupling optical fibers to optoelectronic components'20067,097,884'Stability of ion beam generated alignment layers by surface modification'20067,033,648'Means of seeding and metallizing polyimide'20066,985,645'Apparatus and methods for integrally packaging optoelectronic devices, IC chips and optical transmission lines'20066,924,171'Bilayer wafer-level underfill'20056,874,950'Devices and methods for side-coupling optical fibers to optoelectronic components'20056,816,225'LCD cell construction by mechanical thinning of a color filter substrate'20046,791,639'Direct view display with lenticular lens for improved brightness and wide viewing angle'20046,741,302'System and method for utilizing diffuse and specular radiation to overcome shadowed regions'20046,707,444'Projector and camera arrangement with shared optics and optical marker for use with whiteboard systems'20046,665,033'Method for forming alignment layer by ion beam surface modification'20036,648,485'Highly collimating tapered light guide for uniform illumination of flat panel displays'20036,597,410'System for the automatic adaptation of projector images and a method for the implementation thereof'20036,395,650'Methods for forming metal oxide layers with enhanced purity'20026,371,616'Information processing miniature devices with embedded projectors'20026,310,713'Optical system for miniature personal displays using reflective light valves'20016,247,816'Optical system for projection displays using spatial light modulators'20016,219,183'Compact rear projection display with telescopic screen and variable image size'20016,019,474'Modified X-cube arrangement for improved contrast projection display'20005,991,150'Self deploying magnifier for a portable computer display screen'19995,984,478'Dynamic optical compensation for color sequential projection display'19995,929,962'Method and apparatus for integrating microlens array into a liquid crystal display device using a sacrificial substrate'19995,921,650'High efficiency field-sequential color projector using two SLMs'19995,896,232'Highly efficient and compact frontlighting for polarization-based reflection light valves'19995,863,125'High efficiency two-SLM projector employing total-internal-reflection prism'19995,830,332'Sputter deposition of hydrogenated amorphous carbon film and applications thereof'19985,796,509'Thin film frontlighting and backlighting for spatial light modulators'19985,793,836'X-ray mask pellicle'19985,791,754'Compact desktop projection display using three mirrors'19985,786,934'Efficient optical system for a high resolution projection display employing reflection light valves'19985,786,873'Efficient optical system for a high resolution projection display employing reflection light valves'19985,777,789'Efficient optical system for a high resolution projection display employing reflection light valves'19985,644,432'Three prism color separator'19975,621,486'Efficient optical system for a high resolution projection display employing reflection light valves'19975,597,222'Optical relay lens system for projection displays'19975,569,501'Diamond-like carbon films from a hydrocarbon helium plasma'19965,534,094'Method for fabricating multi-layer thin film structure having a separation layer'19965,531,022'Method of forming a three dimensional high performance interconnection package'19965,521,709'Continuous barcode marking system'19965,517,340'High performance projection display with two light valves'19965,470,661'Diamond-like carbon films from a hydrocarbon helium plasma'19955,433,631'Flex circuit card elastomeric cable connector assembly'19955,387,484'Two-sided mask for patterning of materials with electromagnetic radiation'19955,386,344'Flex circuit card elastomeric cable connector assembly'19955,371,654'Three dimensional high performance interconnection package'19945,314,709'Unzippable polymer mask for screening operations'19945,258,236'Multi-layer thin film structure and parallel processing method for fabricating same'1993Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1993–2021Patents assigned to IBM (93)· patent assignee history
1993–2021Based in Katonah, NY, US· patent location history
1998Based in Westchester, NY, US· patent location history
2012–2016Patents assigned to DOANY FUAD E (6)· patent assignee history
2012–2016Patents assigned to SCHOW CLINT L (6)· patent assignee history
2012–2013Patents assigned to DOANY FUAD ELIAS (3)· patent assignee history
2012Based in Yorktown Heights, NY, US· patent location history
2013–2014Patents assigned to RYLYAKOV ALEXANDER V (4)· patent assignee history
2017Based in New York, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 93 | 1993–2021 |
| DOANY FUAD Eself | 6 | 2012–2016 |
| SCHOW CLINT L | 6 | 2012–2016 |
| RYLYAKOV ALEXANDER V | 4 | 2013–2014 |
| DOANY FUAD ELIASself | 3 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Katonah, New York, US | 90 | 1993–2021 |
| New York, New York, US | 1 | 2017 |
| Yorktown Heights, New York, US | 1 | 2012 |
| Westchester, New York, US | 1 | 1998 |