Inventor
CHUN-HSIEN CHIEN
Inventor
TW
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
H01LSemiconductor devices21%
H05KPrinted circuits21%
G01RMeasuring electric variables8%
H01QAntennas, i.e. radio aerials8%
H04BTransmission4%
H10HInorganic light-emitting semiconductor devices having potential barriers4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
PatentTitleYear
12,309,943Circuit carrier and manufacturing method thereof and package structure202512,292,468Inspection system and inspection method of bare circuit board202512,219,711Bare circuit board202511,678,441Manufacturing method of circuit carrier board structure202311,579,178Inspection apparatus for bare circuit board202311,532,543Manufacturing method of package carrier202211,348,869Method of manufacturing chip packaging structure202211,251,350Light-emitting diode package and manufacturing method thereof202211,201,123Substrate structure and manufacturing method thereof202111,139,234Package carrier and manufacturing method thereof2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to UNIMICRON TECHNOLOGY CORP (10)· patent assignee history
2021–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UNIMICRON TECHNOLOGY CORP | 10 | 2021–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 10 | 2021–2025 |