Inventor
Kouji Motomura
Inventor
Ibaraki, JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C09Jprimary
C09JAdhesives25%
H05KPrinted circuits25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
Y10TTechnical subjects covered by former us classification25%
PatentTitleYear
8,120,189'Wiring terminal-connecting adhesive'20128,115,322'Adhesive, method of connecting wiring terminals and wiring structure'20128,034,447'Electronic components mounting adhesive and electronic components mounting structure'20117,777,335'Wiring structure having a wiring-terminal-connecting adhesive comprising silicone particles'20107,241,644'Adhesive, method of connecting wiring terminals and wiring structure'20076,939,913'Adhesive agent, method of connecting wiring terminals and wiring structure'2005Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2005–2012Patents assigned to HITACHI CHEMICAL CO LTD (5)· patent assignee history
2005–2012Based in Ibaraki, JP· patent location history
2011Based in Saga, JP· patent location history
2012Patents assigned to ARIFUKU MOTOHIRO (2)· patent assignee history
2012Patents assigned to FUJINAWA TOHRU (2)· patent assignee history
2012Patents assigned to GOTOH YASUSHI (2)· patent assignee history
2012Patents assigned to KOBAYASHI KOUJI (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI CHEMICAL CO LTD | 5 | 2005–2012 |
| ARIFUKU MOTOHIRO | 2 | 2012 |
| FUJINAWA TOHRU | 2 | 2012 |
| GOTOH YASUSHI | 2 | 2012 |
| KOBAYASHI KOUJI | 2 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ibaraki, JP | 5 | 2005–2012 |
| Saga, JP | 1 | 2011 |