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Inventor

Yin Yu Chang

Inventor
Hwaseong-si, KR

Overview

2→
Patents
2009–2021
Patent span
Performing operations
Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics17%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts17%
G06FElectric digital data processing17%
G06TImage data processing or generation, in general17%
H04MTelephonic communication17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
PatentTitleYear
10,895,955Apparatus and method for grouping and displaying icons on a screen20217,523,914'High-hardness and corrosion-tolerant integrated circuit packing mold'2009

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2009Patents assigned to CHANG YIN YU (1)· patent assignee history
2009Patents assigned to LIU SHIEN CHEN (1)· patent assignee history
2009Patents assigned to WANG DA YUNG (1)· patent assignee history
2009Based in Taipei, TW· patent location history
2021Patents assigned to SAMSUNG ELECTRONICS CO LTD (1)· patent assignee history
2021Based in Hwaseong-si, KR· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CHANG YIN YUself12009
LIU SHIEN CHEN12009
SAMSUNG ELECTRONICS CO LTD12021
WANG DA YUNG12009
Locations
LocationPatentsSpan
Hwaseong-si, KR12021
Taipei, TW12009