Inventor
Maciej Wojnowski
Inventor
Munich, DE
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H01LSemiconductor devices20%
H01QAntennas, i.e. radio aerials16%
G01SRadio direction-finding4%
H01FMagnets4%
H01PWaveguides4%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems4%
H04BTransmission4%
H05KPrinted circuits4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
PatentTitleYear
10,930,541Method of forming a chip arrangement, chip arrangement, method of forming a chip package, and chip package202110,916,484Electronic device including redistribution layer pad having a void202110,833,583Methods of manufacturing inductor modules and power semiconductor systems having inductor modules202010,692,824Radar module with wafer level package and underfill202010,601,314Power semiconductor systems having inductor modules, and methods of manufacturing inductor modules and power semiconductor systems having inductor modules202010,217,695Connector block with two sorts of through connections, and electronic device comprising a connector block201910,186,481Semiconductor device including a passive component formed in a redistribution layer201910,121,751Integrated antennas in wafer level package20189,922,946'Method of manufacturing a semiconductor package having a semiconductor chip and a microwave component'20189,910,145'Wireless communication system, a radar system and a method for determining a position information of an object'20189,653,426'Method of manufacturing a semiconductor package having an integrated microwave component'20179,583,811'Transition between a plastic waveguide and a semiconductor chip, where the semiconductor chip is embedded and encapsulated within a mold compound'20179,577,852'Common-mode suppressor based on differential transmission line'20179,356,332'Integrated-circuit module with waveguide transition element'20169,349,696'Integrated antennas in wafer level package'20169,337,522'Millimeter-wave system including a waveguide transition connected to a transmission line and surrounded by a plurality of vias'20169,337,159'Semiconductor package with integrated microwave component'20169,230,926'Functionalised redistribution layer'20169,064,787'Integrated antennas in wafer level package'20158,952,521'Semiconductor packages with integrated antenna and method of forming thereof'20158,866,292'Semiconductor packages with integrated antenna and methods of forming thereof'20148,669,655'Chip package and a method for manufacturing a chip package'20148,624,381'Integrated antennas in wafer level package'20148,460,967'Integrated antennas in wafer level package'20138,451,618'Integrated antennas in wafer level package'20138,278,749'Integrated antennas in wafer level package'2012Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2012–2021Patents assigned to INFINEON TECHNOLOGIES AG (24)· patent assignee history
2012–2014Patents assigned to WOJNOWSKI MACIEJ (4)· patent assignee history
2012–2013Patents assigned to LACHNER RUDOLF (2)· patent assignee history
2012–2021Based in Munich, DE· patent location history
2014Patents assigned to BAUER MICHAEL (1)· patent assignee history
2018–2019Based in München, DE· patent location history
2020Patents assigned to INFINEON TECHNOLOGIES AUSTRIA AG (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 24 | 2012–2021 |
| WOJNOWSKI MACIEJself | 4 | 2012–2014 |
| INFINEON TECHNOLOGIES AUSTRIA AG | 2 | 2020 |
| LACHNER RUDOLF | 2 | 2012–2013 |
| BAUER MICHAEL | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Munich, DE | 24 | 2012–2021 |
| München, DE | 2 | 2018–2019 |