Inventor
JEONGSEOK KIM
Inventor
KR
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices28%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1018%
H04NPictorial communication, e.g. television10%
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light6%
G06TImage data processing or generation, in general4%
G01KMeasuring temperature3%
H03FAmplifiers1%
H03KPulse technique1%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation1%
PatentTitleYear
12,593,684Semiconductor package including heat dissipation structure202612,519,051Semiconductor package device202612,499,558Apparatus and method for monitoring moving target based on complementary gimbal control through displacement partitioning202512,394,708Semiconductor package202512,278,191Semiconductor packages having wiring patterns202512,261,105Semiconductor package202512,183,665Semiconductor package202412,159,826Semiconductor package and method of manufacturing the semiconductor package202412,119,305Semiconductor package202412,111,206Vision sensor including a voltage generation circuit for outputting a test bias voltage to a transistor and operating method thereof202412,069,352Vision sensor and operating method thereof202412,046,562Semiconductor package202412,040,297Methods of manufacturing semiconductor packages202412,021,020Semiconductor package202411,916,002Semiconductor package202411,902,673Electronic device for compensating for time delay of dynamic vision sensor202411,728,283Package substrate and semiconductor package including the same202311,721,620Fan-out type semiconductor package202311,700,438Vision sensor and operating method thereof202311,581,284Semiconductor package with under-bump metal structure202311,569,158Semiconductor package202311,569,175Semiconductor package202311,562,966Semiconductor package202311,398,420Semiconductor package having core member and redistribution substrate202211,388,361Image sensor, imaging device including image sensor, and method of operating imaging device202211,153,517Dynamic vision sensor device including buffer2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to SAMSUNG ELECTRONICS CO LTD (25)· patent assignee history
2021–2026Based in KR· patent location history
2025Patents assigned to AGENCY DEFENSE DEV (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 25 | 2021–2026 |
| AGENCY DEFENSE DEV | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 26 | 2021–2026 |