Inventor
Zhiqiang Niu
Inventor
Santa Clara, CA, US
Overview
Patents· 25 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
H01LSemiconductor devices26%
H10DInorganic electric semiconductor devices14%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems5%
H02PControl or regulation of electric motors, electric generators or dynamo-electric converters4%
H05KPrinted circuits3%
H02JElectric power networks2%
H02KDynamo-electric machines2%
Y02BClimate change mitigation technologies related to buildings, e.g. housing, house appliances or related end-user applications2%
PatentTitleYear
10,763,221HV converter with reduced EMI202010,600,727Molded intelligent power module for motors202010,438,900HV converter with reduced EMI201910,396,019Molded intelligent power module and method of making the same201910,177,080Molded intelligent power module201910,141,249Molded intelligent power module and method of making the same201810,056,893Molded power module having single in-line leads201810,043,736Hybrid packaged lead frame based multi-chip semiconductor device with multiple interconnecting structures20189,966,328Semiconductor power device having single in-line lead module and method of making the same20189,881,856'Molded intelligent power module'20189,837,386Power device and preparation method thereof20179,768,146'Battery protection package and process of making the same'20179,754,864'Semiconductor power device having single in-line lead module and method of making the same'20179,704,789'Molded intelligent power module'20179,685,430'Embedded package and method thereof'20179,564,406'Battery protection package and process of making the same'20179,520,380'Wafer process for molded chip scale package (MCSP) with thick backside metallization'20169,425,181'Method of hybrid packaging a lead frame based multi-chip semiconductor device with multiple interconnecting structures'20169,318,424'MCSP power semiconductor devices and preparation methods thereof'20169,269,699'Embedded package and method thereof'20169,245,861'Wafer process for molded chip scale package (MCSP) with thick backside metallization'20169,136,154'Substrateless power device packages'20159,054,091'Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures'20158,987,878'Substrateless power device packages'20158,703,545'Aluminum alloy lead-frame and its use in fabrication of power semiconductor package'2014Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2014–2018Patents assigned to ALPHA & OMEGA SEMICONDUCTOR (15)· patent assignee history
2014–2015Patents assigned to NIU ZHIQIANG (3)· patent assignee history
2014–2015Patents assigned to HUO YAN (2)· patent assignee history
2014Based in Songjiang, CN· patent location history
2015–2020Based in Santa Clara, CA, US· patent location history
2015Based in Shanghai, CN· patent location history
2017–2018Patents assigned to ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD (2)· patent assignee history
2018–2020Patents assigned to ALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD (8)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ALPHA & OMEGA SEMICONDUCTOR | 15 | 2014–2018 |
| ALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD | 8 | 2018–2020 |
| NIU ZHIQIANGself | 3 | 2014–2015 |
| ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD | 2 | 2017–2018 |
| HUO YAN | 2 | 2014–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Santa Clara, California, US | 23 | 2015–2020 |
| Shanghai, CN | 1 | 2015 |
| Songjiang, CN | 1 | 2014 |