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Inventor

Atsushi Matsushita

Inventor
Kanagawa, JP

Overview

25→
Patents
1993–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 25 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
H01JElectric discharge tubes or discharge lamps9%
H01LSemiconductor devices8%
Y10TTechnical subjects covered by former us classification6%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form5%
H01BCables5%
C03CChemical composition of glasses, glazes or vitreous enamels3%
C23CCoating metallic material3%
H01QAntennas, i.e. radio aerials3%
PatentTitleYear
11,012,674Information processing apparatus, image generation method, control method, and program202110,094,024Method of manufacturing multilayer body, method of processing substrate, and multilayer body20189,492,986'Laminate and method for separating the same'20169,099,534'Manufacturing method of semiconductor device, semiconductor device and electronic apparatus'20159,048,311'Laminate and method for separating the same'20159,023,172'Method of manufacturing laminate'20158,786,089'Manufacturing method of semiconductor device, semiconductor device and electronic apparatus'20148,287,807'Analyzer and communication method'20127,538,038'Method of removing resist, semiconductor device thereby and method of manufacturing a semiconductor device'20097,338,897'Method of fabricating a semiconductor device having metal wiring'20087,172,965'Method for manufacturing semiconductor device'20076,995,096'Method for forming multi-layer wiring structure'20066,836,073'Simultaneous discharge apparatus'20046,758,222'Processing method for substrate'20046,723,633'Method for forming multi-layer wiring structure'20046,664,199'Coating liquid for forming a silica group coating film having a small dielectric constant'20036,649,534'Methods for processing a coating film and for manufacturing a semiconductor element'20036,509,279'Methods for processing a coating film and for manufacturing a semiconductor element'20036,503,825'Method for forming multi-layer wiring structure'20036,067,930'Coaxial plasma processing apparatus'20005,846,329'Plasma processing apparatus'19985,435,880'Plasma processing apparatus'19955,364,488'Coaxial plasma processing apparatus'19945,220,339'Antenna having a core of an amorphous material'19935,220,338'Antenna Element'1993

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1993Patents assigned to CREATIC JAPAN INC (2)· patent assignee history
1994–2018Patents assigned to TOKYO OHKA KOGYO CO LTD (15)· patent assignee history
1994–2004Based in Kanagawa, JP· patent location history
2007–2008Based in Nagasaki, JP· patent location history
2009–2015Patents assigned to SONY CORP (3)· patent assignee history
2012–2018Patents assigned to MATSUSHITA ATSUSHI (5)· patent assignee history
2012–2021Based in Tokyo, JP· patent location history
2014–2015Based in Kumamoto, JP· patent location history
2015–2018Patents assigned to FUJII YASUSHI (3)· patent assignee history
2015–2018Based in Kawasaki, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TOKYO OHKA KOGYO CO LTD151994–2018
MATSUSHITA ATSUSHIself52012–2018
FUJII YASUSHI32015–2018
SONY CORP32009–2015
CREATIC JAPAN INC21993
Locations
LocationPatentsSpan
Kanagawa, JP101994–2004
Kawasaki, JP42015–2018
Tokyo, JP22012–2021
Kumamoto, JP22014–2015
Nagasaki, JP22007–2008