Inventor
Chien-Hui Chen
Inventor
Zhongli City, TW
Overview
Patents· 31 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1028%
H01LSemiconductor devices21%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
H10DInorganic electric semiconductor devices9%
B81BMicrostructural devices or systems, e.g. micromechanical devices4%
G06FElectric digital data processing3%
G06VImage or video recognition or understanding3%
G06KGraphical data reading2%
G11CStatic stores2%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light2%
PatentTitleYear
10,388,541Wafer coating system and method of manufacturing chip package20199,711,403'Method for forming chip package'20179,478,469'Integrated circuit comprising buffer chain'20169,437,478'Chip package and method for forming the same'20169,425,134'Chip package'20169,355,970'Chip package and method for forming the same'20169,355,975'Chip package and method for forming the same'20169,349,710'Chip package and method for forming the same'20169,318,461'Wafer level array of chips and method thereof'20169,305,843'Chip package and method for forming the same'20169,275,963'Semiconductor structure having stage difference surface and manufacturing method thereof'20169,209,124'Chip package'20159,184,092'Chip package and method for forming the same'20159,165,890'Chip package comprising alignment mark and method for forming the same'20159,024,437'Chip package and method for forming the same'20158,981,842'Integrated circuit comprising buffer chain'20158,963,312'Stacked chip package and method for forming the same'20158,952,501'Chip package and method for forming the same'20158,951,836'Chip package and method for forming the same'20158,878,367'Substrate structure with through vias'20148,836,134'Semiconductor stacked package and method of fabricating the same'20148,778,707'High-reflection submount for light-emitting diode package and fabrication method thereof'20148,698,316'Chip package'20148,692,382'Chip package'20148,643,070'Chip package and method for forming the same'20148,558,262'High-reflection submount for light-emitting diode package and fabrication method thereof'20138,552,565'Chip package and method for forming the same'20138,525,345'Chip package and method for forming the same'20138,113,412'Methods for detecting defect connections between metal bumps'20127,975,157'Host device with power-saving function'20117,283,733'System and method for regulating a load by utilizing pulse width modulation'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2012–2017Patents assigned to CHEN CHIEN-HUI (11)· patent assignee history
2012–2016Based in Jhudong Township, TW· patent location history
2013–2019Patents assigned to XINTEC INC (20)· patent assignee history
2013–2017Patents assigned to LIU TSANG-YU (6)· patent assignee history
2013–2015Patents assigned to YEN YU-LIN (5)· patent assignee history
2013–2017Based in Zhongli City, TW· patent location history
2013–2014Based in Taoyuan County, TW· patent location history
2014–2017Patents assigned to HO YEN-SHIH (4)· patent assignee history
2014Based in Jhubei City, TW· patent location history
2016–2019Based in Taoyuan, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| XINTEC INC | 20 | 2013–2019 |
| CHEN CHIEN-HUIself | 11 | 2012–2017 |
| LIU TSANG-YU | 6 | 2013–2017 |
| YEN YU-LIN | 5 | 2013–2015 |
| HO YEN-SHIH | 4 | 2014–2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Zhongli City, TW | 21 | 2013–2017 |
| Jhudong Township, TW | 3 | 2012–2016 |
| Taoyuan, TW | 2 | 2016–2019 |
| Taoyuan County, TW | 2 | 2013–2014 |
| Jhubei City, TW | 1 | 2014 |