Inventor
Jae-Woong Nah
Inventor
Closter, NJ, US
Overview
Patents· 118 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%
H01LSemiconductor devices15%
B23KSoldering or unsoldering12%
H05KPrinted circuits10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
Y10TTechnical subjects covered by former us classification5%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution2%
Y02PClimate change mitigation technologies in the production or processing of goods2%
A61BDiagnosis2%
A61MDevices for introducing media into, or onto, the body2%
PatentTitleYear
11,043,690Sandwich-parallel micro-battery202110,964,925Hermetial via seal for thin film battery202110,937,735Hybrid under-bump metallization component202110,879,202System and method for forming solder bumps202010,766,086Injection-molded solder (IMS) tool assembly and method of use thereof202010,740,667Temperature triggered switch202010,692,795Flip chip assembly of quantum computing devices202010,692,831Stud bumps for post-measurement qubit frequency modification202010,679,931Ball grid array and land grid array assemblies fabricated using temporary resist202010,658,267Metal cored solder decal structure and process202010,581,037Low-profile battery construct with engineered interfaces202010,546,836Wafer level integration including design/co-design, structure process, equipment stress management and thermal management202010,535,592Method for forming solder bumps using sacrificial layer202010,490,525High speed handling of ultra-small chips by selective laser bonding and debonding201910,393,962Optimized stand-offs and mechanical stops for precise three dimensional self-alignment201910,383,572Via and trench filling using injection molded soldering201910,350,713No clean flux composition and methods for use thereof201910,258,279Via and trench filling using injection molded soldering201910,249,559Ball grid array and land grid array assemblies fabricated using temporary resist201910,147,694Direct injection molded solder process for forming solder bumps on wafers201810,130,302Via and trench filling using injection molded soldering201810,079,375Dual seal microbattery and method of making201810,014,274Optimized solder pads for microelectronic components20189,972,556Metal cored solder decal structure and process20189,953,908Method for forming solder bumps using sacrificial layer20189,897,627'Test probe substrate'20189,875,985Flip-chip bonder with induction coils and a heating element20189,861,313'Via and trench filling using injection molded soldering'20189,851,379Test probe substrate20179,820,395'Low cost hermetic micro-electronics'20179,808,874'Flux composition and techniques for use thereof'20179,773,751'Via and trench filling using injection molded soldering'20179,761,516'Via and trench filling using injection molded soldering'20179,721,919'Solder bumps formed on wafers using preformed solder balls with different compositions and sizes'20179,721,864'Low cost hermetic micro-electronics'20179,704,822'Bonding substrates using solder surface tension during solder reflow for three dimensional self-alignment of substrates'20179,660,116'Nanowires formed by employing solder nanodots'20179,633,925'Visualization of alignment marks on a chip covered by a pre-applied underfill'20179,606,308'Three dimensional self-alignment of flip chip assembly using solder surface tension during solder reflow'20179,606,142'Test probe substrate'20179,579,738'Flux composition and techniques for use thereof'20179,508,566'Wafer level overmold for three dimensional surfaces'20169,466,590'Optimized solder pads for microelectronic components'20169,418,976'Chip stack with electrically insulating walls'20169,393,633'Method of joining a chip on a substrate'20169,343,420'Universal solder joints for 3D packaging'20169,343,423'No flow underfill or wafer level underfill and solder columns'20169,321,245'Injection of a filler material with homogeneous distribution of anisotropic filler particles through implosion'20169,318,641'Nanowires formed by employing solder nanodots'20169,305,866'Intermetallic compound filled vias'20169,305,896'No flow underfill or wafer level underfill and solder columns'20169,295,166'Double solder bumps on substrates for low temperature flip chip bonding'20169,275,879'Multi-chip module with rework capability'20169,273,408'Direct injection molded solder process for forming solder bumps on wafers'20169,263,378'Ball grid array and land grid array assemblies fabricated using temporary resist'20169,252,120'Copper post solder bumps on substrates'20169,231,133'Nanowires formed by employing solder nanodots'20169,095,081'Double solder bumps on substrates for low temperature flip chip bonding'20159,093,446'Chip stack with electrically insulating walls'20159,082,754'Metal cored solder decal structure and process'20159,012,266'Copper post solder bumps on substrates'20158,993,379'Chip stack with electrically insulating walls'20158,987,132'Double solder bumps on substrates for low temperature flip chip bonding'20158,978,960'Flip chip assembly apparatus employing a warpage-suppressor assembly'20158,963,340'No flow underfill or wafer level underfill and solder columns'20158,945,995'Copper post solder bumps on substrates'20158,944,306'Forming metal preforms and metal balls'20158,921,221'IMS (injection molded solder) with two resist layers forming solder bumps on substrates'20148,912,045'Three dimensional flip chip system and method'20148,889,456'Method of fabricating uniformly distributed self-assembled solder dot formation for high efficiency solar cells'20148,875,978'Forming constant diameter spherical metal balls'20148,877,556'Copper post solder bumps on substrates'20148,870,051'Flip chip assembly apparatus employing a warpage-suppressor assembly'20148,841,544'Uniformly distributed self-assembled solder dot formation for high efficiency solar cells'20148,833,636'Forming an array of metal balls or shapes on a substrate'20148,828,860'Double solder bumps on substrates for low temperature flip chip bonding'20148,820,612'Injection molded solder process for forming solder bumps on substrates'20148,759,961'Underfill material dispensing for stacked semiconductor chips'20148,759,963'Underfill material dispensing for stacked semiconductor chips'20148,685,858'Formation of metal nanospheres and microspheres'20148,669,137'Copper post solder bumps on substrate'20148,652,941'Wafer dicing employing edge region underfill removal'20148,651,359'Flip chip bonder head for forming a uniform fillet'20148,561,880'Forming metal preforms and metal balls'20138,541,291'Thermo-compression bonded electrical interconnect structure and method'20138,541,299'Electrical interconnect forming method'20138,523,046'Forming an array of metal balls or shapes on a substrate'20138,496,159'Injection molded solder process for forming solder bumps on substrates'20138,492,262'Direct IMS (injection molded solder) without a mask for forming solder bumps on substrates'20138,476,773'Electrical interconnect structure'20138,408,448'Forming constant diameter spherical metal balls'20138,381,962'Injection molded solder method for forming solder bumps on substrates'20138,381,966'Flip chip assembly method employing post-contact differential heating'20138,376,207'Micro-fluidic injection molded solder (IMS)'20138,342,387'Spherical solder reflow method'20138,272,120'Apparatus for applying solder to semiconductor chips using decals with aperatures present therein'20128,268,719'Sprocket opening alignment process and apparatus for multilayer solder decal'20128,242,010'Electrical interconnect forming method'20128,162,200'Micro-fluidic injection molded solder (IMS)'20128,164,192'Thermo-compression bonded electrical interconnect structure'20128,162,203'Spherical solder reflow method'20128,136,714'Micro-fluidic injection molded solder (IMS)'20128,138,020'Wafer level integrated interconnect decal and manufacturing method thereof'20128,087,566'Techniques for arranging solder balls and forming bumps'20128,053,283'Die level integrated interconnect decal manufacturing method and apparatus'20118,043,893'Thermo-compression bonded electrical interconnect structure and method'20118,008,122'Pressurized underfill cure'20117,980,446'Micro-fluidic injection molded solder (IMS)'20117,931,187'Injection molded solder method for forming solder bumps on substrates'20117,928,585'Sprocket opening alignment process and apparatus for multilayer solder decal'20117,906,420'Method and apparatus for forming planar alloy deposits on a substrate'20117,891,538'Techniques for arranging solder balls and forming bumps'20117,868,457'Thermo-compression bonded electrical interconnect structure and method'20117,867,842'Method and apparatus for forming planar alloy deposits on a substrate'20117,838,954'Semiconductor structure with solder bumps'20107,786,001'Electrical interconnect structure and method'20107,780,063'Techniques for arranging solder balls and forming bumps'20106,362,090'Method for forming flip chip bump and UBM for high speed copper interconnect chip using electroless plating method'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2010–2021Patents assigned to IBM (107)· patent assignee history
2010–2021Based in Closter, NJ, US· patent location history
2010–2020Based in Yorktown Heights, NY, US· patent location history
2010Based in Cioster, NJ, US· patent location history
2012–2017Patents assigned to NAH JAE-WOONG (40)· patent assignee history
2012–2015Patents assigned to GRUBER PETER A (15)· patent assignee history
2012–2016Patents assigned to LAURO PAUL A (7)· patent assignee history
2012–2018Based in New York, NY, US· patent location history
2012–2016Based in Armonk, NY, US· patent location history
2016–2018Patents assigned to GLOBALFOUNDRIES INC (7)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 107 | 2010–2021 |
| NAH JAE-WOONGself | 40 | 2012–2017 |
| GRUBER PETER A | 15 | 2012–2015 |
| GLOBALFOUNDRIES INC | 7 | 2016–2018 |
| LAURO PAUL A | 7 | 2012–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Closter, New Jersey, US | 61 | 2010–2021 |
| New York, New York, US | 39 | 2012–2018 |
| Armonk, New York, US | 9 | 2012–2016 |
| Yorktown Heights, New York, US | 7 | 2010–2020 |
| Cioster, New Jersey, US | 1 | 2010 |