Inventor
JYUN-SIANG PENG
Inventor
TW
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices37%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1037%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1026%
PatentTitleYear
12,381,176Semiconductor structure having a conductive feature comprising an adhesion layer and a metal region over and contacting the adhesion layer202512,362,309Package structure202512,021,026Package structure and method of fabricating the same202411,996,381Package structure and method of fabricating the same202411,756,879Semiconductor devices and methods of manufacturing the same202311,742,317Process including a re-etching process for forming a semiconductor structure202311,670,582Package structure and method of fabricating the same202311,587,902Semiconductor structure and method of forming the same202311,557,561Package structure and method of fabricating the same202311,251,121Package structure and method of fabricating the same2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (10)· patent assignee history
2022–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 10 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 10 | 2022–2025 |