Inventor
FREDERICK CHEN
Inventor
US
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Bprimary
H10BElectronic memory devices23%
G11CStatic stores19%
H01LSemiconductor devices16%
H10NElectric solid-state devices not otherwise provided for16%
H10DInorganic electric semiconductor devices6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
G06FElectric digital data processing3%
G06NComputing arrangements based on specific computational models3%
PatentTitleYear
12,588,201Memory device with increased density and method of fabricating the same202612,185,553Semiconductor device and method of forming the same202412,040,218Method of forming a semiconductor device202411,972,799Filament forming method for resistive memory unit202411,823,738Resistive memory apparatus202311,785,869Memory device and method of manufacturing the same202311,620,500Synapse system and synapse method to realize STDP operation202311,520,526Write method for resistive memory202211,362,272Resistive memory device and reliability enhancement method thereof by using ratio of set current and reference current202211,289,541Resistive random access memory devices and methods for forming the same202211,289,157Memory device2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to WINBOND ELECTRONICS CORP (11)· patent assignee history
2022–2026Based in US· patent location history
2022–2024Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| WINBOND ELECTRONICS CORP | 11 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 7 | 2022–2026 |
| TW | 4 | 2022–2024 |