Inventor
SUNG KYU KIM
Inventor
KR
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices18%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
C22CAlloys10%
C21DModifying the physical structure of ferrous metals8%
H10BElectronic memory devices6%
H10DInorganic electric semiconductor devices6%
G06VImage or video recognition or understanding5%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation5%
B05DProcesses for applying fluent materials to surfaces, in general2%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients2%
PatentTitleYear
12,522,887High-strength steel sheet having excellent hole expandability and method for manufacturing same202612,463,114Semiconductor chip including through electrode, and semiconductor package including the same202512,327,779Semiconductor chip including through electrode, and semiconductor package including the same202512,255,126Semiconductor devices including substrates bonded to each other and methods for fabricating the same202512,230,661Electronic device package and fabricating method thereof202512,221,680Cryogenic austenitic high-manganese steel having excellent corrosion resistance, and manufacturing method therefor202512,040,308Method of manufacturing a semiconductor device202411,961,867Electronic device package and fabricating method thereof202411,946,742Angle detection of hinges in rollable devices202411,873,546Austenitic steel material having excellent hot workability and manufacturing method therefor202411,855,023Wafer level fan out semiconductor device and manufacturing method thereof202311,823,982Semiconductor chip including through electrode, and semiconductor package including the same202311,659,776High temperature-superconducting wire having superconducting layer staked thereon and method for manufacturing same202311,634,800High-strength austenite-based high-manganese steel material and manufacturing method for same202311,594,471Semiconductor chip including through electrode, and semiconductor package including the same202311,584,970High manganese steel for low temperature applications having excellent surface quality and a manufacturing method thereof202311,502,051Semiconductor chip including through electrode, and semiconductor package including the same202211,492,499Composite resin composition for steel plate for fuel tank, composite resin-coated steel plate using same, and manufacturing method therefor202211,362,128Electronic device package and fabricating method thereof2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to SK HYNIX INC (7)· patent assignee history
2022–2025Patents assigned to AMKOR TECH SINGAPORE HOLDING PTE LTD (4)· patent assignee history
2022–2025Patents assigned to POSCO (4)· patent assignee history
2022–2026Based in KR· patent location history
2023–2026Patents assigned to POSCO CO LTD (5)· patent assignee history
2023Patents assigned to KERI KOREA ELECTROTECHNOLOGY RES INST (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SK HYNIX INC | 7 | 2022–2025 |
| POSCO CO LTD | 5 | 2023–2026 |
| AMKOR TECH SINGAPORE HOLDING PTE LTD | 4 | 2022–2025 |
| POSCO | 4 | 2022–2025 |
| KERI KOREA ELECTROTECHNOLOGY RES INST | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 19 | 2022–2026 |