Inventor
Kristopher Frutschy
Inventor
Phoenix, AZ, US
Overview
Patents· 30 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution12%
Y10TTechnical subjects covered by former us classification12%
H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy11%
H05KPrinted circuits11%
H01RElectrically-conductive connections6%
F01DNon-positive displacement machines or engines, e.g. steam turbines3%
F05DIndexing scheme for aspects relating to non-positive-displacement machines or engines, gas-turbines or jet-propulsion plants3%
B23PMetal-working not otherwise provided for2%
B25BTools or bench devices not otherwise provided for, for fastening, connecting, disengaging, or holding2%
PatentTitleYear
10,502,073Blades and damper sleeves for a rotor assembly201910,333,184Heat flux assembly for an energy storage device201910,046,426Hydraulic ram bolt tensioning device20189,806,387'Energy storage device with reduced temperature variability between cells'20179,683,454'Method and system for monitoring non-rotating turbomachine parts'20179,012,060'System and method for battery insulation'20158,916,285'Modular high temperature battery electrical configurations'20148,901,463'Thermal management device'20148,674,218'Restraint system for an energy storage device'20148,665,591'Systems and methods to thermally manage electronic devices'20148,227,078'Anti-fouling coatings for combustion system components exposed to slag, ash and/or char'20127,809,101'Modular multispot X-ray source and method of making same'20107,691,671'Radiant energy heating for die attach'20107,585,693'Method of forming a microelectronic package using control of die and substrate differential expansions and microelectronic package formed according to the method'20097,209,026'Integrated package inductor for integrated circuit devices'20077,187,066'Radiant energy heating for die attach'20077,173,329'Package stiffener'20077,154,175'Ground plane for integrated circuit package'20067,131,850'Socket for a microelectronic component having reduced electrical resistance and inductance'20067,064,004'Induction-based heating for chip attach'20067,045,890'Heat spreader and stiffener having a stiffener extension'20066,975,518'Printed circuit board housing clamp'20056,877,223'Method of fabrication for a socket with embedded conductive structure'20056,750,551'Direct BGA attachment without solder reflow'20046,661,660'Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment'20036,639,799'Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment'20036,586,684'Circuit housing clamp and method of manufacture therefor'20036,535,386'Electronic assembly having a heat pipe that conducts heat from a semiconductor die'20036,428,358'Socket with embedded conductive structure and method of fabrication therefor'20026,221,459'Controlling the heat expansion of electrical couplings'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2010Patents assigned to INTEL CORP (18)· patent assignee history
2001–2010Based in Phoenix, AZ, US· patent location history
2010–2019Patents assigned to GEN ELECTRIC (12)· patent assignee history
2010–2019Based in Clifton Park, NY, US· patent location history
2012–2014Patents assigned to FRUTSCHY KRISTOPHER JOHN (4)· patent assignee history
2012Patents assigned to AVAGLIANO AARON JOHN (1)· patent assignee history
2014Patents assigned to WATERS WILLIAM (2)· patent assignee history
2014–2018Based in Schenectady, NY, US· patent location history
2014Based in Niskayuna, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 18 | 2001–2010 |
| GEN ELECTRIC | 12 | 2010–2019 |
| FRUTSCHY KRISTOPHER JOHNself | 4 | 2012–2014 |
| WATERS WILLIAM | 2 | 2014 |
| AVAGLIANO AARON JOHN | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Phoenix, AZ, US | 18 | 2001–2010 |
| Clifton Park, New York, US | 7 | 2010–2019 |
| Schenectady, New York, US | 3 | 2014–2018 |
| Niskayuna, New York, US | 2 | 2014 |