Inventor
HAO-JAN PEI
Inventor
TW
Overview
Patents· 27 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices32%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1027%
B23KSoldering or unsoldering6%
H10DInorganic electric semiconductor devices2%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation1%
PatentTitleYear
12,581,977Bonding through multi-shot laser reflow202612,564,008Method and treatment system for uniform processing of semiconductor devices202612,564,055Package structure and method of fabricating the same202612,564,054Package structure202612,489,030Methods of manufacturing integrated fan-out packages with embedded heat dissipation structure202512,417,927Semiconductor device and method of manufacture202512,388,060Integrated fan-out packages and methods of forming the same202512,368,149Methods of forming semiconductor packages202512,368,053Method for laser drilling process for an integrated circuit package202512,266,559Method of manufacturing semiconductor package, method of handling wafer, and method of handling workpiece202512,261,088Package structure and method of forming the same202512,230,597Package structure with warpage-control element202512,176,319Reflow method and system202412,107,064Semiconductor package and manufacturing method thereof202412,040,309Bonding through multi-shot laser reflow202411,996,400Manufacturing method of package on package structure202411,942,464Semiconductor package and method202411,901,258Iintegrated fan-out packages with embedded heat dissipation structure202411,862,577Package structure and method of fabricating the same202411,830,746Semiconductor device and method of manufacture202311,791,192Workpiece holder, wafer chuck, wafer holding method202311,721,659Package structure with warpage-control element202311,610,859Reflow method and system202311,462,507Bonding through multi-shot laser reflow202211,342,321Manufacturing method of package on package structure202211,309,294Integrated fan-out packages and methods of forming the same202211,211,341Package structure and method of fabrcating the same2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (27)· patent assignee history
2021–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 27 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 27 | 2021–2026 |