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Inventor

Young Jin Woo

Inventor
Daejeon, KR

Overview

16→
Patents
2002–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 16 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices14%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems14%
H03KPulse technique14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
Y02BClimate change mitigation technologies related to buildings, e.g. housing, house appliances or related end-user applications11%
G09GArrangements or circuits for control of indicating devices using static means to present variable information7%
H10DInorganic electric semiconductor devices7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
G05FSystems for regulating electric or magnetic variables4%
G11CStatic stores4%
PatentTitleYear
10,615,686Multi-level step-up converters with flying capacitor202010,319,329Gate driving circuit, level shifter, and display device201910,298,219Pass switch circuit with improved time response characteristics and method of controlling same201910,008,922Switching power supply20189,742,404'Level shifter circuit with improved time response and control method thereof'20179,625,932'Switching mode converter having 100% duty cycle mode and method for controlling thereof'20179,536,488'Gamma voltage supply circuit and method and power management IC'20179,166,047'Switch circuit using LDMOS device'20159,153,494'Semiconductor die and method of forming Fo-WLCSP vertical interconnect using TSV and TMV'20158,895,440'Semiconductor die and method of forming Fo-WLCSP vertical interconnect using TSV and TMV'20148,836,027'Switch circuit using LDMOS element'20148,576,635'Nonvolatile memory device and method of operating the same'20138,183,089'Method for manufacturing package system incorporating flip-chip assembly'20127,859,120'Package system incorporating a flip-chip assembly'20107,786,715'Dc/dc converter'20106,437,360'Vacuum field transistor'2002

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2002Based in Yongin-si, KR· patent location history
2010–2015Patents assigned to STATS CHIPPAC LTD (4)· patent assignee history
2010–2020Based in Daejeon, KR· patent location history
2010–2012Based in Ichon-si, KR· patent location history
2012–2014Patents assigned to WOO YOUNG JIN (4)· patent assignee history
2012Patents assigned to CHOI A LEAM (1)· patent assignee history
2014–2020Patents assigned to SILICON WORKS CO LTD (9)· patent assignee history
2014Patents assigned to CHOI DAESIK (1)· patent assignee history
2014–2015Based in Kyonggi-do, KR· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SILICON WORKS CO LTD92014–2020
STATS CHIPPAC LTD42010–2015
WOO YOUNG JINself42012–2014
CHOI A LEAM12012
CHOI DAESIK12014
Locations
LocationPatentsSpan
Daejeon, KR112010–2020
Kyonggi-do, KR22014–2015
Ichon-si, KR22010–2012
Yongin-si, KR12002