Inventor
PO-HAN WANG
Inventor
TW
Overview
Patents· 34 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices31%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1024%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices6%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation3%
H04WWireless communication networks2%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use2%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds1%
C09JAdhesives1%
H04BTransmission1%
PatentTitleYear
12,550,777Semiconductor device, semiconductor package and manufacturing method thereof202612,550,778Semiconductor package and method of forming the same202612,476,139Integrated circuit package and method202512,469,759Semiconductor package202512,416,862Apparatus, system and method202512,381,186Redistribution structure for semiconductor device and method of forming same202512,374,592Semiconductor device and manufacturing method thereof202512,347,801Semiconductor package and method for manufacturing the same202512,349,068Low power Wi-Fi backscatter communication202512,322,688Package structure including auxiliary dielectric portion202512,298,667Lithography202512,242,197Apparatus, system and method202512,170,223Method of fabricating redistribution circuit structure202412,094,765Integrated circuit package and method202412,051,659Semiconductor devices having conductive pad structures with multi-barrier films202411,973,023Stacked via structure202411,948,918Redistribution structure for semiconductor device and method of forming same202411,942,435Semiconductor package and method202411,942,417Sensor package and method202411,892,774Lithography202411,842,902Semiconductor package with alignment mark and manufacturing method thereof202311,817,352Method of fabricating redistribution circuit structure202311,688,703Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier films202311,682,647Semiconductor package and method for manufacturing the same202311,682,636Info structure and method forming same202311,664,323Semiconductor package and method202311,570,709BLE and/or WiFi compliant and blocker-resilient wake-up receiver and method202311,532,531Semiconductor package202211,532,540Planarizing RDLS in RDL-first processes through CMP process202211,393,749Stacked via structure202211,342,296Semiconductor structure, semiconductor package and method of fabricating the same202211,309,265Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier films202211,227,795Integrated circuit package and method202211,164,839Package structure and method of manufacturing the same2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (32)· patent assignee history
2021–2026Based in TW· patent location history
2023–2025Patents assigned to UNIV CALIFORNIA (2)· patent assignee history
2023–2025Based in US· patent location history
2025Patents assigned to TAIWAN SEMICONDUCTOR MFG LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 32 | 2021–2026 |
| UNIV CALIFORNIA | 2 | 2023–2025 |
| TAIWAN SEMICONDUCTOR MFG LTD | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 32 | 2021–2026 |
| US | 2 | 2023–2025 |