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Inventor

Huanfeng Zhu

Inventor
West Linn, CA

Overview

3→
Patents
2013–2018
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C25Dprimary
C25DProcesses for the electrolytic or electrophoretic production of coatings25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices17%
H01LSemiconductor devices8%
PatentTitleYear
10,006,144Method and apparatus for filling interconnect structures20188,703,615'Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafers'20148,575,028'Method and apparatus for filling interconnect structures'2013

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2013–2018Patents assigned to NOVELLUS SYSTEMS INC (3)· patent assignee history
2013–2014Patents assigned to REID JONATHAN D (2)· patent assignee history
2013–2014Patents assigned to ZHU HUANFENG (2)· patent assignee history
2013Based in Tualatin, OR, US· patent location history
2014Patents assigned to MAYER STEVEN T (1)· patent assignee history
2014Patents assigned to PONNUSWAMY THOMAS A (1)· patent assignee history
2014Based in Tigard, OR, US· patent location history
2018Based in West Linn, CA· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
NOVELLUS SYSTEMS INC32013–2018
REID JONATHAN D22013–2014
ZHU HUANFENGself22013–2014
MAYER STEVEN T12014
PONNUSWAMY THOMAS A12014
Locations
LocationPatentsSpan
West Linn, CA12018
Tigard, OR, US12014
Tualatin, OR, US12013