Inventor
William BREZINSKI
Inventor
US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
C25BElectrolytic or electrophoretic processes for the production of compounds or non-metals8%
H04BTransmission8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution8%
Y02PClimate change mitigation technologies in the production or processing of goods8%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry4%
C01BNon-metallic elements4%
C02FTreatment of water, waste water, sewage, or sludge4%
PatentTitleYear
11,887,887Interconnect structures and methods of fabrication202411,846,032Enhanced water electrolysis with protic co-catalysts202311,784,123Methods and structures for improved electrical contact between bonded integrated circuit interfaces202311,649,548Metallopolymers for catalytic generation of hydrogen202311,532,558Metallization barrier structures for bonded integrated circuit interfaces202211,404,307Interconnect structures and methods of fabrication202211,289,421Methods and structures for improved electrical contact between bonded integrated circuit interfaces2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to INTEL CORP (5)· patent assignee history
2022–2024Based in US· patent location history
2023Patents assigned to UNIV ARIZONA (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 5 | 2022–2024 |
| UNIV ARIZONA | 2 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 7 | 2022–2024 |