Inventor

Heinrich Meyer

Inventor
Berlin, DE

Overview

43→
Patents
1979–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 43 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits17%
C25DProcesses for the electrolytic or electrophoretic production of coatings9%
C23CCoating metallic material9%
F16FSprings8%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds3%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application3%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices3%
Y10TTechnical subjects covered by former us classification3%
B05DProcesses for applying fluent materials to surfaces, in general3%
PatentTitleYear
10,802,132Position-sensing sensor and position-sensing system202010,192,080Method for configuring a communication module of at least one radio-frequency identification (RFID) reader and communication module20198,783,667'Axially damping hydraulic mount'20148,042,792'Hydraulic engine bearing'20117,380,698'Method of connecting module layers suitable for the production of microstructure modules and a microstructure module'20087,138,043'Method for applying a metal layer to a light metal surface'20067,119,687'System for tracking object locations using self-tracking tags'20066,865,081'Microstructure cooler and use thereof'20056,793,795'Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits'20046,736,983'Method for producing microcomponents'20046,723,385'Process for the preliminary treatment of copper surfaces'20046,706,201'Method for producing metallized substrate materials'20046,593,249'Method for forming a metal pattern on a dielectric substrate'20036,562,149'Solution and process to pretreat copper surfaces'20036,451,498'Photosensitive composition'20026,409,072'Chemical microreactors and method for producing same'20026,403,168'Process for plating metal coatings'20026,375,172'Hydraulically-damping engine bearing'20026,325,910'Palladium colloid solution and its utilization'20016,321,443'Connection substrate'20016,240,934'Method and device for treating holes or recesses extending into workpieces with liquid treatment media'20016,235,182'Solution for pretreatment of electrically non-conductive surfaces, and method of coating the surfaces with solid material particles'20016,221,440'Process for plating metal coating'20016,220,584'Hydraulically damping engine bearing'20016,197,387'Method to prepare the production of structured metal coatings using proteins'20016,120,672'Process for manufacturing inductive counting systems'20006,099,711'Process for the electrolytic deposition of metal layers'20005,954,317'Hydraulically damping rubber bearing'19995,916,485'Method of manufacturing highly conducting composites containing only small proportions of electron conductors'19995,895,031'Hydraulically damping engine mounting'19995,705,219'Method for coating surfaces with finely particulate materials'19985,693,209'Process for metallization of a nonconductor surface'19975,597,471'Solution for coating non-conductors with conductive polymers and their metallization process'19975,503,877'Complex oligomeric or polymeric compounds for the generation of metal seeds on a substrate'19965,487,076'Method for securing data in read-write memories in mobile data storage systems'19965,386,973'Elastomeric bearing'19955,183,552'Process for metallization of a nonconductor surface, especially on a circuit board having preexisting copper surfaces'19934,939,370'Method of and device for inspecting and/or controlling metallization processes'19904,781,362'Hydraulically damping elastic bearing'19884,765,874'Laminated electrode the use thereof'19884,697,794'Rubber mounting with hydraulic damping'19874,318,964'Autopin machine'19824,176,448'Autopin machine'1979

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1979–1982Patents assigned to GEN STAPLE CO (2)· patent assignee history
1979–1982Based in Ormond Beach, FL, US· patent location history
1987–1999Patents assigned to BOGE GMBH (4)· patent assignee history
1987–2001Based in Konigswinter, DE· patent location history
1990–2008Based in Berlin, DE· patent location history
1996–2020Patents assigned to SIEMENS AG (4)· patent assignee history
1997–2008Patents assigned to ATOTECH DEUTSCHLAND GMBH (22)· patent assignee history
2001Patents assigned to FRAUNHOFER GES FORSCHUNG (2)· patent assignee history
2011–2014Based in Königswinter, DE· patent location history
2020Based in Cadolzburg, DE· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ATOTECH DEUTSCHLAND GMBH221997–2008
BOGE GMBH41987–1999
SIEMENS AG41996–2020
FRAUNHOFER GES FORSCHUNG22001
GEN STAPLE CO21979–1982
Locations
LocationPatentsSpan
Berlin, DE271990–2008
Konigswinter, DE61987–2001
Königswinter, DE22011–2014
Ormond Beach, Florida, US21979–1982
Cadolzburg, DE12020