Inventor

Tetsuya Tokunaga

Inventor
Gunma, JP

Overview

29→
Patents
1977–2020
Patent span
Physics
Primary field (CPC G)

Patents· 29 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G09Gprimary
G09GArrangements or circuits for control of indicating devices using static means to present variable information23%
G06FElectric digital data processing15%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
H03KPulse technique6%
H04LTransmission of digital information, e.g. telegraphic communication6%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry4%
B23KSoldering or unsoldering4%
H03MCoding4%
A62CFire-fighting2%
B22DCasting of metals2%
PatentTitleYear
10,824,264Methods and system for a capacitive touch sensor202010,698,540Methods and apparatus for a capacitive touch sensor202010,495,505Capacitance liquid level sensor20199,041,638'Liquid crystal driving circuit having a common-signal output circuit and a segment-signal output circuit and method'20158,941,571'Liquid crystal driving circuit'20158,238,385'Data processing circuit and data processing method'20128,154,496'Liquid crystal display drive circuit'20128,081,095'Data output circuit'20118,082,375'Noise-tolerant data communication system'20118,018,445'Serial data input system'20117,724,060'Interface circuit and a clock output method therefor'20107,619,547'Serial-to-parallel converter circuit and liquid crystal display driving circuit'20097,400,307'Driving circuit for vacuum fluorescent display'20087,379,036'Driving circuit for vacuum fluorescent display'20087,312,769'Driving circuit for vacuum fluorescent display'20077,221,198'Interface circuit and a clock output method therefor'20077,199,676'Frequency adjustment circuit'20076,902,101'Bump bonding method apparatus'20056,712,111'Bonding method and apparatus'20046,680,221'Bare chip mounting method and bare chip mounting system'20046,653,999'Integrated circuit for driving liquid crystal'20036,633,271'Integrated circuit for driving liquid crystal'20036,474,538'Bonding apparatus and bonding method'20026,246,388'Display driving circuit for displaying character on display panel'20015,938,746'System for prioritizing slave input register to receive data transmission via bi-directional data line from master'19994,225,297'Nozzle pre-heating device in a prilling apparatus'19804,220,441'Apparatus for making prills from melted substance'19804,072,531'Plugging compositions for blast furnace tap holes'19784,058,403'Refractory compositions'1977

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1977–1980Based in Fujieda, JP· patent location history
1999–2010Patents assigned to SANYO ELECTRIC CO (11)· patent assignee history
2001–2015Based in Gunma, JP· patent location history
2002–2004Based in Kadoma, JP· patent location history
2004–2005Based in Takatsuki, JP· patent location history
2009–2012Patents assigned to SANYO SEMICONDUCTOR CO LTD (5)· patent assignee history
2011–2015Patents assigned to SEMICONDUCTOR COMPONENTS IND (7)· patent assignee history
2011–2015Patents assigned to TOKUNAGA TETSUYA (6)· patent assignee history
2011–2015Patents assigned to GOTO KENSUKE (4)· patent assignee history
2019–2020Based in Oura-gun, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SANYO ELECTRIC CO111999–2010
SEMICONDUCTOR COMPONENTS IND72011–2015
TOKUNAGA TETSUYAself62011–2015
SANYO SEMICONDUCTOR CO LTD52009–2012
GOTO KENSUKE42011–2015
Locations
LocationPatentsSpan
Gunma, JP162001–2015
Fujieda, JP41977–1980
Oura-gun, JP32019–2020
Takatsuki, JP22004–2005
Kadoma, JP22002–2004