Inventor

Yutaka Hirasawa

Inventor

Tokyo, JP

Overview

1987–2018

Patent span

Electricity

Primary field (CPC H)

Patents· 33 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary

H05KPrinted circuits21%

Y10TTechnical subjects covered by former us classification17%

C25DProcesses for the electrolytic or electrophoretic production of coatings13%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests12%

H04LTransmission of digital information, e.g. telegraphic communication5%

D05BSewing4%

G06FElectric digital data processing4%

LOC134%

LOC264%

C23CCoating metallic material3%

PatentTitleYear

9,873,965Loop material sewing method and loop sewing machine2018 D0550869'LED lamp'2007 D0550379'LED lamp'2007 D0546985'LED lamp'2007 D0520657'LED lamp'2006 D0508234'LED holder'2005 6,902,824'Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same'2005 D0505663'LED holder'2005 D0505662'LED holder'2005 6,827,867'Method for manufacturing printed wiring board'2004 6,716,572'Manufacturing process for printed wiring board'2004 6,616,827'Filtration method of copper electrolyte'2003 6,610,418'Electolytic copper foil with carrier foil and method for manufacturing the same'2003 6,605,369'Surface-treated copper foil and method for producing the same'2003 6,548,153'Composite material used in making printed wiring boards'2003 6,479,170'Electrodeposited copper foil, method of inspecting physical properties thereof, and copper-clad laminate employing the electrodeposited copper foil'2002 6,444,112'Manufacturing method of electrodeposited copper foil'2002 6,319,620'Making and using an ultra-thin copper foil'2001 6,270,889'Making and using an ultra-thin copper foil'2001 6,223,667'Belt-loop sewing machine'2001 5,997,710'Copper foil for a printed circuit board, a process and an apparatus for producing the same'1999 5,897,761'Electrodeposited copper foil for printed wiring board and method for manufacturing the same'1999 5,858,517'Electrodeposited copper foil for printed wiring board and method of manufacturing the same'1999 5,833,819'Copper foil for a printed circuit board, a process and an apparatus for producing the same'1998 5,640,917'Welt forming device, and fabric guide'1997 5,545,466'Copper-clad laminate and printed wiring board'1996 5,504,866'Lan control system'1996 5,437,914'Copper-clad laminate and printed wiring board'1995 5,341,363'Computer system capable of disconnecting itself from a lan'1994 5,029,075'Routing method in a computer communication network system'1991 4,992,931'Data alignment correction apparatus for properly formatting data structures for different computer architectures'1991 4,887,075'Local area network system with a multi-computer system coupled thereto and method for controlling the same'1989 4,675,252'Base material having a dyed membrane on the surface thereof, and method for dyeing a membrane thereon'1987

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1987Based in Ohmiya, JP· patent location history

1989–1996Patents assigned to TOSHIBA KK (5)· patent assignee history

1989Based in Kokubunji, JP· patent location history

1991–2018Based in Tokyo, JP· patent location history

1995–2005Patents assigned to MITSUI MINING & SMELTING CO (16)· patent assignee history

1995–2003Based in Okegawa, JP· patent location history

1997–2018Patents assigned to JUKI KK (3)· patent assignee history

1999Patents assigned to MITSUI MINING & SMLETING CO LT (1)· patent assignee history

2002–2005Based in Ageo, JP· patent location history

2005–2007Patents assigned to MORIYAMA SANGYO KK (7)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
MITSUI MINING & SMELTING CO	16	1995–2005
MORIYAMA SANGYO KK	7	2005–2007
TOSHIBA KK	5	1989–1996
JUKI KK	3	1997–2018
MITSUI MINING & SMLETING CO LT	1	1999

Locations

Location	Patents	Span
Tokyo, JP	14	1991–2018
Okegawa, JP	10	1995–2003
Ageo, JP	7	2002–2005
Kokubunji, JP	1	1989
Ohmiya, JP	1	1987