Inventor
Toshihiro Hosoi
Inventor
Saitama, JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits25%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form17%
H04MTelephonic communication17%
B60RVehicles, vehicle fittings, or vehicle parts, not otherwise provided for8%
C06DMeans for generating smoke or mist8%
G08BSignalling systems, e.g. personal calling systems8%
H04LTransmission of digital information, e.g. telegraphic communication8%
H04WWireless communication networks8%
PatentTitleYear
10,524,360Copper clad laminate for forming of embedded capacitor layer, multilayered printed wiring board, and manufacturing method of multilayered printed wiring board201910,244,640Copper clad laminate provided with protective layer and multilayered printed wiring board201910,134,264Emergency report apparatus20189,924,597'Copper clad laminate for forming of embedded capacitor layer, multilayered printed wiring board, and manufacturing method of multilayered printed wiring board'20188,684,399'Gas generator and airbag apparatus'20147,756,265'On-board hands-free communication apparatus'2010Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2010–2018Patents assigned to DENSO CORP (2)· patent assignee history
2010Based in Nagoya, JP· patent location history
2014Patents assigned to TOYODA GOSEI KK (1)· patent assignee history
2014Based in Kiyosu, JP· patent location history
2018–2019Patents assigned to MITSUI MINING & SMELTING CO (3)· patent assignee history
2018–2019Based in Saitama, JP· patent location history
2018Based in Kariya, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUI MINING & SMELTING CO | 3 | 2018–2019 |
| DENSO CORP | 2 | 2010–2018 |
| TOYODA GOSEI KK | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Saitama, JP | 3 | 2018–2019 |
| Kariya, JP | 1 | 2018 |
| Kiyosu, JP | 1 | 2014 |
| Nagoya, JP | 1 | 2010 |