Inventor
Sung Gue Lee
Inventor
Gyeonggi-do, KR
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits46%
Y10TTechnical subjects covered by former us classification28%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
C25DProcesses for the electrolytic or electrophoretic production of coatings3%
H01LSemiconductor devices3%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation3%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution3%
PatentTitleYear
9,666,733'Solar cell using printed circuit board'20178,426,739'Printed circuit board and method for manufacturing the same, and panel for manufacturing the printed circuit board'20137,337,535'Hole plugging method for printed circuit boards, and hole plugging device'20087,320,173'Method for interconnecting multi-layer printed circuit board'20087,304,249'Bonding pads for a printed circuit board'20077,257,891'Method for forming bonding pads'20077,208,341'Method for manufacturing printed circuit board'20077,189,302'Multi-layer printed circuit board and fabricating method thereof'20077,098,533'Printed circuit board with a heat dissipation element and package comprising the printed circuit board'20067,049,178'Method for fabricating semiconductor package and semiconductor package'20066,954,985'Method for plugging holes in a printed circuit board'20056,851,184'Method for manufacturing a printed circuit board'20056,849,294'Method for fabricating circuit pattern of printed circuit board'20056,803,257'Printed circuit board with a heat dissipation element, method for manufacturing the printed circuit board, and package comprising the printed circuit board'20046,740,352'Method for forming bonding pads'20046,706,564'Method for fabricating semiconductor package and semiconductor package'20046,641,983'Method for forming exposed portion of circuit pattern in printed circuit board'20036,509,634'Chip mounting structure having adhesive conductor'20036,210,518'Method and fixture for manufacturing flexible printed circuit board'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2008Patents assigned to LG ELECTRONICS INC (17)· patent assignee history
2001–2008Based in Osan, KR· patent location history
2003Based in Pyungtaek, KR· patent location history
2004–2017Based in Gyeonggi-do, KR· patent location history
2004–2006Based in Kyungki-do, KR· patent location history
2013–2017Patents assigned to LEE SUNG GUE (2)· patent assignee history
2013Patents assigned to CHOI JAE BONG (1)· patent assignee history
2013Patents assigned to LEE KWANG TAE (1)· patent assignee history
2013Based in Gumi-si, KR· patent location history
2017Patents assigned to AHN HYEON WOO (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LG ELECTRONICS INC | 17 | 2001–2008 |
| LEE SUNG GUEself | 2 | 2013–2017 |
| AHN HYEON WOO | 1 | 2017 |
| CHOI JAE BONG | 1 | 2013 |
| LEE KWANG TAE | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Gyeonggi-do, KR | 8 | 2004–2017 |
| Kyungki-do, KR | 5 | 2004–2006 |
| Osan, KR | 4 | 2001–2008 |
| Gumi-si, KR | 1 | 2013 |
| Pyungtaek, KR | 1 | 2003 |