Inventor

Takema Adachi

Inventor

Ogaki, JP

Overview

26→

Patents

2014–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 26 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary

H05KPrinted circuits46%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%

H01LSemiconductor devices13%

Y10TTechnical subjects covered by former us classification10%

B29CShaping or joining of plastics2%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%

C23CCoating metallic material2%

C25DProcesses for the electrolytic or electrophoretic production of coatings2%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation2%

Y02PClimate change mitigation technologies in the production or processing of goods2%

PatentTitleYear

10,645,819Printed wiring board2020 10,477,699Method for manufacturing electronic component attached wiring board2019 10,440,823Printed wiring board2019 10,405,426Printed wiring board2019 10,375,828Printed wiring board2019 10,368,440Printed wiring board2019 10,314,168Printed wiring board2019 10,271,468Shield cap and method for manufacturing the same2019 10,231,369Shield cap and method for manufacturing the same2019 10,231,336Printed wiring board for mounting electronic component2019 10,221,497Method for manufacturing wiring board with conductive post2019 10,219,383Printed wiring board and method for manufacturing the same2019 10,194,569Shield cap and method for manufacturing the same2019 10,182,518Shield cap and method for manufacturing the same2019 10,070,523Printed wiring board with conductor post having multiple surface roughness and method for manufacturing the same2018 9,980,371Printed wiring board2018 9,837,345Interposer and circuit substrate2017 9,420,708'Method for manufacturing multilayer printed wiring board'2016 9,401,320'Combined substrate'2016 9,185,799'Printed wiring board'2015 9,078,366'Printed wiring board and method for manufacturing the same'2015 9,048,229'Printed wiring board'2015 8,931,168'Method for manufacturing multilayer printed wiring board'2015 8,772,646'Printed wiring board and method for manufacturing printed wiring board'2014 8,742,553'Printed wiring board'2014 8,692,129'Package-substrate-mounting printed wiring board and method for manufacturing the same'2014

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2014–2020Patents assigned to IBIDEN CO LTD (26)· patent assignee history

2014–2016Patents assigned to ADACHI TAKEMA (4)· patent assignee history

2014Patents assigned to KASAI TOSHIAKI (1)· patent assignee history

2014Patents assigned to UEDA KAZUYUKI (1)· patent assignee history

2014–2020Based in Ogaki, JP· patent location history

2015–2016Patents assigned to HIBINO TOSHIAKI (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
IBIDEN CO LTD	26	2014–2020
ADACHI TAKEMAself	4	2014–2016
HIBINO TOSHIAKI	2	2015–2016
KASAI TOSHIAKI	1	2014
UEDA KAZUYUKI	1	2014

Locations

Location	Patents	Span
Ogaki, JP	26	2014–2020