Inventor
Yuichi Matsuda
Inventor
Nagano, JP
Overview
Patents· 32 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
H05KPrinted circuits17%
Y10TTechnical subjects covered by former us classification13%
H01LSemiconductor devices8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
G01RMeasuring electric variables5%
G06FElectric digital data processing4%
H04LTransmission of digital information, e.g. telegraphic communication4%
B29CShaping or joining of plastics3%
C08JWorking-up3%
PatentTitleYear
10,858,507Fiber-reinforced polypropylene-based resin composition and molded product thereof20209,921,874'Storage medium, information processing device, and information processing method'20189,698,037'Substrate processing apparatus'20179,535,743'Data processing control method, computer-readable recording medium, and data processing control device for performing a Mapreduce process'20179,488,677'Probe card having a wiring substrate'20169,476,913'Probe card'20169,470,718'Probe card'20169,459,289'Probe card and method for manufacturing probe card'20169,460,983'Joining structure using thermal interface material'20169,373,587'Stacked electronic device'20169,344,347'Delay time measuring apparatus, computer readable record medium on which delay time measuring program is recorded, and delay time measuring method'20169,202,781'Wiring substrate, method for manufacturing wiring substrate, and semiconductor package'20159,204,544'Wiring substrate and method of manufacturing the same'20159,006,586'Wiring substrate, its manufacturing method, and semiconductor device'20158,832,496'Information managing computer product, apparatus, and method'20148,664,764'Semiconductor device including a core substrate and a semiconductor element'20148,638,542'Capacitor containing a large number of filamentous conductors and method of manufacturing the same'20148,362,369'Wiring board'20138,324,513'Wiring substrate and semiconductor apparatus including the wiring substrate'20128,242,612'Wiring board having piercing linear conductors and semiconductor device using the same'20128,138,609'Semiconductor device and method of manufacturing semiconductor device'20127,847,021'Aliphatic polyester resin composition containing copolymer'20107,763,809'Multilayered substrate for semiconductor device and method of manufacturing same'20107,725,548'Computer-readable recording medium recording communication programs, communication method and communication apparatus'20107,482,063'Molded object obtained by in-mold coating and process for producing the same'20096,931,724'Insulated multilayered substrate having connecting leads for mounting a semiconductor element thereon'20056,828,669'Interconnection substrate having metal columns covered by a resin film, and manufacturing method thereof'20046,756,430'Flame-retarding thermoplastic resin composition'20046,441,314'Multilayered substrate for semiconductor device'20026,418,615'Method of making multilayered substrate for semiconductor device'20025,636,206'System for achieving alarm masking processing'19975,510,515'Process for purifying polar vinyl compound'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2018Patents assigned to FUJITSU LTD (6)· patent assignee history
1997–2016Based in Kawasaki, JP· patent location history
2002–2016Patents assigned to SHINKO ELECTRIC IND CO (20)· patent assignee history
2002–2016Based in Nagano, JP· patent location history
2004–2020Based in Sodegaura, JP· patent location history
2012–2017Patents assigned to MATSUDA YUICHI (11)· patent assignee history
2012–2016Patents assigned to HORIUCHI MICHIO (8)· patent assignee history
2012–2016Patents assigned to TOKUTAKE YASUE (8)· patent assignee history
2017–2018Based in Yokohama, JP· patent location history
2017Based in Toyama, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SHINKO ELECTRIC IND CO | 20 | 2002–2016 |
| MATSUDA YUICHIself | 11 | 2012–2017 |
| HORIUCHI MICHIO | 8 | 2012–2016 |
| TOKUTAKE YASUE | 8 | 2012–2016 |
| FUJITSU LTD | 6 | 1997–2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Nagano, JP | 20 | 2002–2016 |
| Sodegaura, JP | 4 | 2004–2020 |
| Kawasaki, JP | 4 | 1997–2016 |
| Yokohama, JP | 2 | 2017–2018 |
| Toyama, JP | 1 | 2017 |