Inventor

Heiichiro Nakamura

Inventor

Tokyo, JP

Overview

1976–2021

Patent span

Performing operations

Primary field (CPC B)

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B05Cprimary

B05CApparatus for applying fluent materials to surfaces, in general13%

B05DProcesses for applying fluent materials to surfaces, in general13%

B23KSoldering or unsoldering13%

B63HMarine propulsion or steering13%

F16CShafts13%

H01LSemiconductor devices13%

H05KPrinted circuits13%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%

PatentTitleYear

Assembled from patent assignee/location history and declaration credentials.

1976Patents assigned to ISHIKAWAJIMA HARIMA HEAVY IND (1)· patent assignee history

1976Based in Yokohama, JP· patent location history

2021Patents assigned to SENJU METAL INDUSTRY CO (1)· patent assignee history

2021Based in Tokyo, JP· patent location history

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
ISHIKAWAJIMA HARIMA HEAVY IND	1	1976
SENJU METAL INDUSTRY CO	1	2021

Locations

Location	Patents	Span
Tokyo, JP	1	2021
Yokohama, JP	1	1976