LexDanaLexDanabeta
Inventor

Cheng-Tien Lai

Inventor
Taipei, TW

Overview

99→
Patents
2002–2013
Patent span
Mechanical engineering
Primary field (CPC F)

Patents· 99 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
F21VFunctional features or details of lighting devices or systems thereof13%
F21YIndexing scheme associated with subclasses f21k, f21l, f21s and f21v, relating to the form or the kind of the light sources or of the colour of the light emitted11%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application8%
F21KNon-electric light sources using luminescence7%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact6%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
F21SNon-portable lighting devices5%
Y10TTechnical subjects covered by former us classification4%
F21WIndexing scheme associated with subclasses f21k, f21l, f21s and f21v, relating to uses or applications of lighting devices or systems2%
PatentTitleYear
8,388,195'Illumination device with heat dissipation structures'20138,196,645'Heat sink with heat pipes'20128,052,300'LED lamp including LED mounts with fin arrays'20117,997,758'Light-guiding module and LED light source using the same'20117,982,225'Heat dissipation device for LED chips'20117,959,327'LED lamp having a vapor chamber for dissipating heat generated by LEDs of the LED lamp'20117,942,196'Heat spreader with vapor chamber'20117,891,845'LED lamp'20117,885,072'Fixing device for heat sink'20117,862,210'LED lamp with heat sink assembly'20117,789,242'Protective packaging for an LED module'20107,768,784'Heat dissipation assembly'20107,766,513'LED lamp with a heat dissipation device'20107,762,689'LED lamp'20107,753,560'LED lamp with a heat sink assembly'20107,753,108'Liquid cooling device'20107,753,662'Miniature liquid cooling device having an integral pump therein'20107,748,876'LED lamp with a heat sink assembly'20107,744,247'LED lamp having double-side heat sink'20107,746,642'Heat sink and a method for manufacturing the same'20107,729,118'Miniature liquid cooling device having an integral pump'20107,726,851'LED lamp with a heat dissipation device'20107,712,927'LED lamp with improved heat dissipating structure'20107,695,162'LED lamp having a plurality of heat sinks'20107,695,161'Heat dissipation device for light emitting diode module'20107,694,721'Miniature liquid cooling device having an integral pump'20107,694,718'Heat sink with heat pipes'20107,682,055'LED lamp'20107,670,034'LED lamp'20107,654,701'Led lamp'20107,655,079'Gas-liquid separation apparatus'20107,648,258'LED lamp with improved heat sink'20107,645,330'Gas-liquid separation apparatus'20107,607,803'LED lamp'20097,597,133'Heat dissipation device with heat pipes'20097,584,781'Liquid-cooling device'20097,576,987'Clip for heat dissipation device'20097,565,925'Heat dissipation device'20097,543,630'Heat pipe incorporating outer and inner pipes'20097,540,636'Heat dissipating light emitting diode module having fastened heat spreader'20097,537,047'Liquid-cooling heat sink'20097,534,015'LED lamp with a heat dissipation device'20097,520,313'Locking device for heat sink'20097,520,640'LED wall lamp with a heat sink'20097,492,599'Heat sink for LED lamp'20097,489,513'Heat dissipation device'20097,484,553'Heat pipe incorporating outer and inner pipes'20097,457,122'Memory module assembly including a clip for mounting a heat sink thereon'20087,447,028'Heat dissipation device'20087,447,029'Vapor chamber for dissipation heat generated by electronic component'2008D0579422'Heat sink for an LED lamp'20087,440,279'Heat dissipation device'20087,438,449'Light emitting diode module having a latching component and a heat-dissipating device'20087,433,194'Heat sink fastening assembly'20087,417,860'Heat dissipation device'20087,407,000'Liquid cooling device'2008D0573288'LED lamp'2008D0573289'LED lamp'2008D0572398'LED lamp'20087,391,613'Memory module assembly including a clamp for mounting heat sinks thereon'20087,375,964'Memory module assembly including a clamp for mounting heat sinks thereon'2008D0567400'LED lamp'20087,349,220'Memory module assembly'20087,349,219'Memory module assembly including a clip for mounting a heat sink thereon'20087,333,338'Memory module assembly including a clip for mounting a heat sink thereon'20087,301,774'Universal locking device for heat sink'20077,292,443'Heat sink mounting assembly'20077,272,007'Locking device for heat sink'20077,240,722'Heat dissipation device'20077,156,160'Integrated liquid cooling system for electronic components'20077,147,043'Integratied liquid cooling system for electrical components'20067,143,815'Liquid cooling device'20067,121,326'Heat sink'20067,110,259'Heat dissipating device incorporating heat pipe'20067,110,261'Heat dissipation assembly'20067,100,677'Integrated liquid cooling system for electrical components'20067,075,790'Heat dissipating device incorporating clip'20067,061,764'Heat sink clip with rotating CAM'20067,028,761'Integrated liquid cooling system for electrical components'20067,013,959'Integrated liquid cooling system for electrical components'20066,988,536'Tubular heat dissipation device'20066,935,410'Heat sink assembly'20056,924,984'Heat sink clip with pivoting locking portions'20056,826,051'Clip for heat sink'20046,808,013'Heat dissipation device with working liquid received in circulatory route'20046,788,536'Fan holder for heat sink'20046,736,196'Fan duct assembly'20046,683,788'Operating device for heat sink'20046,657,863'Fan duct assembly for heat dissipation'20036,650,543'Heat dissipation device'20036,646,881'Mounting assembly for heat sink'20036,611,431'Heat dissipation assembly'20036,568,464'Heat sink clip assembly'20036,542,364'Heat dissipating assembly with heat pipes'20036,538,891'Heat sink clip assembly'20036,480,387'Heat sink assembly'20026,480,388'Back plate assembly for motherboard'20026,430,049'Clip for heat sink'20026,392,889'Fastener for heat sink'2002

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2002–2006Patents assigned to HON HAI PREC IND CO LTD (24)· patent assignee history
2002Patents assigned to FOXCONN PREC COMPONENTS CO LTD (2)· patent assignee history
2002–2013Based in Taipei, TW· patent location history
2002–2009Based in Tu-Chen, TW· patent location history
2006–2013Patents assigned to FOXCONN TECH CO LTD (71)· patent assignee history
2006–2013Patents assigned to LAI CHENG-TIEN (3)· patent assignee history
2006–2010Based in Tu-Cheng, TW· patent location history
2006Based in Santa Clara, CA, US· patent location history
2007–2013Patents assigned to FU ZHUN PRECISION IND SHENZHEN (59)· patent assignee history
2007–2009Based in Guangdong, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
FOXCONN TECH CO LTD712006–2013
FU ZHUN PRECISION IND SHENZHEN592007–2013
HON HAI PREC IND CO LTD242002–2006
LAI CHENG-TIENself32006–2013
FOXCONN PREC COMPONENTS CO LTD22002
Locations
LocationPatentsSpan
Taipei, TW452002–2013
Tu-Chen, TW252002–2009
Tu-Cheng, TW192006–2010
Guangdong, CN72007–2009
Santa Clara, California, US22006