Inventor
DAVID JON HINER
Inventor
US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices32%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1026%
H05KPrinted circuits5%
Y10TTechnical subjects covered by former us classification5%
PatentTitleYear
12,438,124Semiconductor package with routing patch and method of fabricating the semiconductor package202512,136,565Semiconductor device package and manufacturing method thereof202411,901,335Semiconductor package with routing patch and conductive interconnection structures laterally displaced from routing patch202411,848,214Encapsulated semiconductor package202311,424,155Semiconductor device package and manufacturing method thereof202211,289,451Semiconductor package with high routing density patch2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to AMKOR TECH SINGAPORE HOLDING PTE LTD (6)· patent assignee history
2022–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AMKOR TECH SINGAPORE HOLDING PTE LTD | 6 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 6 | 2022–2025 |