Inventor

Masayuki Ohishi

Inventor
Neyagawa, JP

Overview

13→
Patents
1994–2020
Patent span
Performing operations
Primary field (CPC B)

Patents· 13 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B62Dprimary
B62DMotor vehicles17%
B23KSoldering or unsoldering15%
C21DModifying the physical structure of ferrous metals10%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form7%
Y02PClimate change mitigation technologies in the production or processing of goods7%
B21KMaking forged or pressed metal products, e.g. horse-shoes, rivets, bolts or wheels5%
B22FWorking metallic powder5%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds5%
C08LCompositions of macromolecular compounds5%
C22CAlloys5%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1994Patents assigned to HORIBA LTD (1)· patent assignee history
1994Based in Kyoto, JP· patent location history
2007–2020Patents assigned to KOMATSU MFG CO LTD (10)· patent assignee history
2007–2020Based in Neyagawa, JP· patent location history
2015Patents assigned to DENKI KAGAKU KOGYO KK (1)· patent assignee history
2015Patents assigned to NAKAZAWA HITOSHI (1)· patent assignee history
2015–2018Based in Ichihara, JP· patent location history
2018Patents assigned to DENKA COMPANY LTD (1)· patent assignee history
2020Based in Tokyo, JP· patent location history
2020Based in Hirakata, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
KOMATSU MFG CO LTD102007–2020
DENKA COMPANY LTD12018
DENKI KAGAKU KOGYO KK12015
HORIBA LTD11994
NAKAZAWA HITOSHI12015
Locations
LocationPatentsSpan
Neyagawa, JP82007–2020
Ichihara, JP22015–2018
Tokyo, JP12020
Hirakata, JP12020
Kyoto, JP11994