Inventor
HSIAO-WEN CHUNG
Inventor
TW
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices24%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
H10DInorganic electric semiconductor devices17%
A61BDiagnosis7%
G01RMeasuring electric variables7%
G06TImage data processing or generation, in general7%
G16HHealthcare informatics, i.e. information and communication technology [ict] specially adapted for the handling or processing of medical or healthcare data7%
G06FElectric digital data processing3%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
PatentTitleYear
12,417,992Chip structure with conductive pillar and method for forming the same202512,412,746Semiconductor device and method for fabricating the same202512,341,071Dummy patterns in redundant region of double seal ring202512,341,113Mandrel fin design for double seal ring202511,855,010Semiconductor structure and method for forming features in redundant region of double seal ring202311,826,136Method for determining ischemic status or assessing stroke onset time of a brain region202311,728,229Dummy patterns in redundant region of double seal ring202311,688,708Chip structure and method for forming the same202311,229,375Method for determining ischemic status or assessing stroke onset time of a brain region2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2023Patents assigned to UNIV TAIPEI MEDICAL (2)· patent assignee history
2022–2025Based in TW· patent location history
2023–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (7)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 7 | 2023–2025 |
| UNIV TAIPEI MEDICAL | 2 | 2022–2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 9 | 2022–2025 |