Inventor
Masaaki Ueno
Inventor
Toyama, JP
Overview
Patents· 33 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1035%
H01LSemiconductor devices14%
C23CCoating metallic material12%
G05DSystems for controlling or regulating non-electric variables5%
F27BFurnaces, kilns, ovens or retorts in general4%
G01KMeasuring temperature4%
LOC104%
F27DDetails or accessories of furnaces, kilns, ovens or retorts, in so far as they are of kinds occurring in more than one kind of furnace3%
G05BControl or regulating systems in general3%
G06FElectric digital data processing3%
PatentTitleYear
10,415,136Substrate processing apparatus including heating and cooling device, and ceiling part included in the same2019D0860420Electric furnace for substrate processing apparatus201910,418,293Substrate processing apparatus, method of manufacturing semiconductor device, and thermocouple support2019D0860419Electric furnace for substrate processing apparatus201910,340,151Substrate processing apparatus, heating apparatus, ceiling heat insulator, and method of manufacturing semiconductor device2019D0819463Protector tube for thermocouple2018D0818850Protector tube for thermocouple2018D0803075'Thermometry tool for substrate processing apparatus'20179,779,970'Heater supporting device'20179,695,511'Substrate processing apparatus, method of manufacturing semiconductor device and method of processing substrate'20179,587,884'Insulation structure and method of manufacturing semiconductor device'20179,418,881'Substrate processing apparatus capable of switching control mode of heater'20169,269,638'Temperature detecting apparatus, substrate processing apparatus and method of manufacturing semiconductor device'20169,184,069'Heating apparatus, substrate processing apparatus employing the same, method of manufacturing semiconductor devices, and insulator'20159,064,912'Heating device, substrate processing apparatus, and method of manufacturing semiconductor device'20158,822,240'Temperature detecting apparatus, substrate processing apparatus and method of manufacturing semiconductor device'20148,734,148'Heat treatment apparatus and method of manufacturing semiconductor device'20148,507,296'Substrate processing method and film forming method'20138,501,599'Substrate processing apparatus and substrate processing method'20138,417,394'Substrate processing apparatus, semiconductor device manufacturing method and temperature controlling method'20138,367,975'Temperature adjustment method'20138,158,911'Heating apparatus, substrate processing apparatus employing the same, method of manufacturing semiconductor devices, and extending member'20128,148,271'Substrate processing apparatus, coolant gas supply nozzle and semiconductor device manufacturing method'20128,116,618'Heating apparatus, substrate processing apparatus, and method of manufacturing semiconductor devices'20127,930,059'Temperature regulating method, thermal processing system and semiconductor device manufacturing method'20117,727,780'Substrate processing method and semiconductor manufacturing apparatus'20107,700,054'Substrate processing apparatus having gas side flow via gas inlet'20107,577,493'Temperature regulating method, thermal processing system and semiconductor device manufacturing method'20097,346,273'Substrate processing equipment'20086,767,752'Temperature control method and semiconductor device manufacturing method'20046,746,908'Temperature controlling method, thermal treating apparatus, and method of manufacturing semiconductor device'20046,662,353'System and program for estimating person-hours required to prepare a pattern film of a circuit to be printed on a board'20033,945,019'Apparatus and method for recording characters so as to enable reading thereof in a feed direction of a recording sheet therefor'1976Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1976Based in Chiba, JP· patent location history
2003–2008Based in Tokyo, JP· patent location history
2004–2019Patents assigned to HITACHI INT ELECTRIC INC (29)· patent assignee history
2009–2019Based in Toyama, JP· patent location history
2012–2017Patents assigned to UENO MASAAKI (13)· patent assignee history
2012–2015Patents assigned to HAYASHIDA AKIRA (7)· patent assignee history
2012–2015Patents assigned to SHIMADA MASAKAZU (6)· patent assignee history
2019Patents assigned to KOKUSAI ELECTRIC CORP (5)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI INT ELECTRIC INC | 29 | 2004–2019 |
| UENO MASAAKIself | 13 | 2012–2017 |
| HAYASHIDA AKIRA | 7 | 2012–2015 |
| SHIMADA MASAKAZU | 6 | 2012–2015 |
| KOKUSAI ELECTRIC CORP | 5 | 2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Toyama, JP | 28 | 2009–2019 |
| Tokyo, JP | 4 | 2003–2008 |
| Chiba, JP | 1 | 1976 |