Inventor
Kazuya Ooji
Inventor
Kamakura, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10100%
PatentTitleYear
6,861,294'Semiconductor devices and methods of making the devices'20056,686,226'Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frame'20046,114,192'Method of manufacturing a semiconductor device having a ball grid array package structure using a supporting frame'20005,914,531'Semiconductor device having a ball grid array package structure using a supporting frame'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2000Patents assigned to HITACHI LTD (2)· patent assignee history
1999–2005Based in Kamakura, JP· patent location history
2004–2005Patents assigned to RENESAS TECH CORP (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI LTD | 2 | 1999–2000 |
| RENESAS TECH CORP | 2 | 2004–2005 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kamakura, JP | 4 | 1999–2005 |