Inventor
Meng Kong Lye
Inventor
Shah Alam, MY
Overview
Patents· 25 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1044%
H01LSemiconductor devices38%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
B60CVehicle tyres2%
B81BMicrostructural devices or systems, e.g. micromechanical devices2%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems2%
D03DWoven fabrics2%
D10BIndexing scheme associated with sublasses of section d, relating to textiles2%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure2%
G06FElectric digital data processing2%
PatentTitleYear
10,787,361Sensor device with flip-chip die and interposer202010,734,311Hybrid lead frame for semiconductor die package with improved creepage distance202010,692,802Flexible semiconductor device with graphene tape202010,515,880Lead frame with bendable leads201910,217,700Lead frame for integrated circuit device having J-leads and Gull Wing leads201910,217,697Semiconductor device and lead frame with high density lead array201910,181,434Lead frame for integrated circuit device having J-leads and gull wing leads201910,041,195Woven signal-routing substrate for wearable electronic devices20189,633,959'Integrated circuit die with corner IO pads'20179,548,255'IC package having non-horizontal die pad and flexible substrate therefor'20179,484,289'Semiconductor device with heat spreader'20169,449,901'Lead frame with deflecting tie bar for IC package'20169,379,035'IC package having non-horizontal die pad and lead frame therefor'20169,355,945'Semiconductor device with heat-dissipating lead frame'20169,337,140'Signal bond wire shield'20169,196,578'Common pin for multi-die semiconductor package'20159,196,576'Semiconductor package with stress relief and heat spreader'20159,190,343'Semiconductor device with tube based heat spreader'20159,177,834'Power bar design for lead frame-based packages'20159,165,869'Semiconductor device with twisted leads'20159,147,656'Semiconductor device with improved shielding'20158,980,690'Lead frame based semiconductor device with routing substrate'20158,901,722'Semiconductor device with integral heat sink'20148,291,368'Method for reducing surface area of pad limited semiconductor die layout'20128,242,613'Bond pad for semiconductor die'2012Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2012–2018Patents assigned to FREESCALE SEMICONDUCTOR INC (17)· patent assignee history
2012–2017Patents assigned to LYE MENG KONG (12)· patent assignee history
2012–2020Based in Shah Alam, MY· patent location history
2014–2016Patents assigned to GE YOU (5)· patent assignee history
2014–2016Patents assigned to MEI PENGLIN (4)· patent assignee history
2018–2020Patents assigned to NXP USA INC (8)· patent assignee history
2018–2020Based in Petaling Jaya, MY· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FREESCALE SEMICONDUCTOR INC | 17 | 2012–2018 |
| LYE MENG KONGself | 12 | 2012–2017 |
| NXP USA INC | 8 | 2018–2020 |
| GE YOU | 5 | 2014–2016 |
| MEI PENGLIN | 4 | 2014–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Shah Alam, MY | 22 | 2012–2020 |
| Petaling Jaya, MY | 3 | 2018–2020 |