Inventor

Won Seok Lee

Inventor
Daejeon, KR

Overview

61→
Patents
1996–2020
Patent span
Chemistry
Primary field (CPC C)

Patents· 61 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C08Lprimary
C08LCompositions of macromolecular compounds11%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds10%
G11CStatic stores9%
G06FElectric digital data processing7%
C08JWorking-up3%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients3%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
A61BDiagnosis2%
B06BMethods or apparatus for generating or transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency, e.g. for performing mechanical work in general2%
G06KGraphical data reading2%
PatentTitleYear
10,703,896Transparent thermoplastic resin and method of preparing the same202010,689,473Graft copolymer, method of preparing graft copolymer, thermoplastic resin composition including graft copolymer, and molded part including thermoplastic resin composition202010,627,511Ultrasonic transducer having flexible printed circuit board with thick metal layer and manufacturing method thereof202010,626,227Method of preparing resin powder and integrated coagulator for the same202010,614,749Source driver unit for a display panel202010,570,283Thermoplastic transparent resin composition for wheel rust cover and method for preparing the same202010,562,531Adaptive cruise control apparatus and method thereof202010,494,989Apparatus for improving efficiency of turbocharger engine201910,422,256Engine brake device201910,329,416Thermoplastic resin composition and molded article manufactured from the same201910,318,188Method of controlling memory cell access based on safe address mapping201910,316,179Transparent thermoplastic resin and method of preparing the same201910,196,511Thermoplastic resin composition and molded product article including the same201910,171,795System and method for generating disparity map by matching stereo images201910,053,573Thermoplastic resin composition and method of preparing the same20189,926,444'Thermoplastic resin composition, method of preparing the same and molded product using the same'20189,840,618'Thermoplastic resin composition having superior chemical resistance and transparency, method of preparing the same and molded article including the same'20179,834,645Thermoplastic resin composition and thermoplastic resin molded article prepared therefrom20179,812,789'Array antenna apparatus for implementing predetermined beam width using predetermined number of antenna elements'20179,790,356'Method of preparing thermoplastic resin'20179,683,069'Method for preparing weather resistant reinforced acrylate based resin'20179,642,697'Breast prosthesis allowing controlled release of drug and production method for same'20179,637,583'Transparent ABS resin and transparent ABS resin composition'20179,624,332'Graft monomer composition for thermoplastic transparent resin, composition for thermoplastic transparent resin using the same, and thermoplastic transparent resin having good transparency and color'20179,547,360'Systems having a maximum sleep mode and method of operating the same'20179,476,380'Engine provided with connecting line connecting each cylinder'20169,470,548'Device, system and method for calibration of camera and laser sensor'20169,466,097'Apparatus and method for removing fog in image'20169,461,360'Apparatus and method for adjusting beam pattern in communication system supporting beam division multiple access scheme'20169,280,713'Apparatus and method for processing image mounted in vehicle'20169,135,417'Apparatus for generating secure key using device and user authentication information'20159,136,139'Jig, manufacturing method thereof, and flip chip bonding method for chips of ultrasound probe using jig'20158,997,209'Memory device comprising a plurality of memory chips, authentication system and authentication method thereof'20158,975,096'Jig, manufacturing method thereof, and flip chip bonding method for chips of ultrasound probe using jig'20158,927,631'Transparent thermoplastic resin composition and molded article prepared therefrom'20158,780,656'Stacked memory device and method of repairing same'20148,190,968'Semiconductor memory device and data error detection and correction method of the same'20128,151,052'Memory card with removable cover'20128,055,844'Memory card and memory storage device using the same'20117,949,928'Semiconductor memory device and data error detection and correction method of the same'20117,889,546'Phase-change random access memory device, system having the same, and associated methods'20117,817,489'Power supplying circuit and phase-change random access memory including the same'20107,710,791'Input circuit of a non-volatile semiconductor memory device'20107,580,278'Variable resistance memory device'20097,579,406'Transparent thermoplastic resin compositions and process for preparing the same'20097,535,760'Memory devices and memory systems having the same'20097,295,464'Phase change memory device and method of programming the same'20076,992,318'Semiconductor device having superlattice semiconductor layer and method of manufacturing the same'20066,888,216'Circuit having make-link type fuse and semiconductor device having the same'20056,754,119'Sense amplifier for memory device'20046,744,064'Nitride semiconductor light emitting device'20046,719,808'Method of and apparatus for manufacturing a semiconductor device using a polysilicon hard mask'20046,657,498'Variable gain low-noise amplifier for a wireless terminal'20036,643,201'Memory device having read charge control, write charge control and floating or precharge circuits'20036,608,982'Drying unit for liquid electrophotographic printing apparatus and liquid carrier drying method using the same'20036,519,020'Liquid crystal display module, using a flexible printed circuit board with enhanced thermocompression characteristics'20036,500,747'Method of manufacturing GaN semiconductor substrate'20026,424,222'Variable gain low noise amplifier for a wireless terminal'20026,348,375'Method of fabricating a bit line structure for a semiconductor device'20026,201,756'Semiconductor memory device and write data masking method thereof'20015,499,377'Multi-computer access switching system'1996

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001–2019Patents assigned to SAMSUNG ELECTRONICS CO LTD (28)· patent assignee history
2002–2017Based in Seoul, KR· patent location history
2003–2019Based in Gyeonggi-do, KR· patent location history
2007–2019Based in Suwon-si, KR· patent location history
2009–2020Patents assigned to LG CHEMICAL LTD (17)· patent assignee history
2012–2017Patents assigned to LEE WON-SEOK (5)· patent assignee history
2015–2020Based in Daejeon, KR· patent location history
2015–2020Based in Daegu, KR· patent location history
2016–2020Patents assigned to HYUNDAI MOTOR CO LTD (8)· patent assignee history
2019–2020Patents assigned to KIA MOTORS CORP (4)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SAMSUNG ELECTRONICS CO LTD282001–2019
LG CHEMICAL LTD172009–2020
HYUNDAI MOTOR CO LTD82016–2020
LEE WON-SEOKself52012–2017
KIA MOTORS CORP42019–2020
Locations
LocationPatentsSpan
Daejeon, KR192015–2020
Suwon-si, KR142007–2019
Seoul, KR72002–2017
Gyeonggi-do, KR62003–2019
Daegu, KR32015–2020