Inventor
Masao Nishizawa
Inventor
Chikuma, JP
Overview
Patents· 2 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B29Cprimary
B29CShaping or joining of plastics18%
G06KGraphical data reading18%
H01QAntennas, i.e. radio aerials18%
Y10TTechnical subjects covered by former us classification18%
B29LIndexing scheme associated with subclass b29c, relating to particular articles9%
H01LSemiconductor devices9%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2015Patents assigned to APIC YAMADA CORP (2)· patent assignee history
2015Patents assigned to ISHIDA FUMIHITO (2)· patent assignee history
2015Patents assigned to KIDA KENJI (2)· patent assignee history
2015Patents assigned to NISHIZAWA MASAO (2)· patent assignee history
2015Patents assigned to HIRANO TADAHIKO (1)· patent assignee history
2015Based in Chikuma, JP· patent location history
2015Based in Nagano, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APIC YAMADA CORP | 2 | 2015 |
| ISHIDA FUMIHITO | 2 | 2015 |
| KIDA KENJI | 2 | 2015 |
| NISHIZAWA MASAOself | 2 | 2015 |
| HIRANO TADAHIKO | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chikuma, JP | 1 | 2015 |
| Nagano, JP | 1 | 2015 |