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Inventor

Christopher V. Jahnes

Inventor
Upper Saddle River, NJ, US

Overview

131→
Patents
1991–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 131 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B81Bprimary
B81BMicrostructural devices or systems, e.g. micromechanical devices12%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems11%
Y10TTechnical subjects covered by former us classification11%
H01HElectric switches9%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
G06FElectric digital data processing8%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%
H01LSemiconductor devices6%
H10NElectric solid-state devices not otherwise provided for6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
PatentTitleYear
11,111,136Use of a reactive, or reducing gas as a method to increase contact lifetime in micro contact MEMS switch devices202111,111,139Planar cavity MEMS and related structures, methods of manufacture and design structures202111,104,572Planar cavity MEMS and related structures, methods of manufacture and design structures202110,811,206Micro-electro-mechanical system (MEMS) and related actuator bumps, methods of manufacture and design structures202010,766,765Planar cavity MEMS and related structures, methods of manufacture and design structures202010,748,725Micro-electro-mechanical system (MEMS) and related actuator bumps, methods of manufacture and design structures202010,640,365Planar cavity MEMS and related structures, methods of manufacture and design structures202010,640,364Planar cavity MEMS and related structures, methods of manufacture and design structures202010,618,803Planar cavity MEMS and related structures, methods of manufacture and design structures202010,589,991Micro-electro-mechanical system (MEMS) structures and design structures202010,589,992Micro-electro-mechanical system (MEMS) structures and design structures202010,584,026Planar cavity MEMS and related structures, methods of manufacture and design structures202010,549,987Micro-electro-mechanical system (MEMS) structures and design structures202010,315,913Planar cavity MEMS and related structures, methods of manufacture and design structures201910,308,506Use of a reactive, or reducing gas as a method to increase contact lifetime in micro contact mems switch devices201910,308,501Planar cavity MEMS and related structures, methods of manufacture and design structures201910,246,319Planar cavity MEMS and related structures, methods of manufacture and design structures201910,214,416Planar cavity MEMS and related structures, methods of manufacture and design structures201910,173,889Planar cavity MEMS and related structures, methods of manufacture and design structures201910,170,262Micro-electro-mechanical system (MEMS) and related actuator bumps, methods of manufacture and design structures201910,147,577Micro-electro-mechanical system (MEMS) and related actuator bumps, methods of manufacture and design structures201810,011,480Planar cavity MEMS and related structures, methods of manufacture and design structures201810,011,477Planar cavity MEMS and related structures, methods of manufacture and design structures20189,981,842Micro-Electro-Mechanical System (MEMS) structures and design structures20189,969,613Method for forming micro-electro-mechanical system (MEMS) beam structure20189,938,137Micro-electro-mechanical system (MEMS) structures and design structures20189,932,225Planar cavity MEMS and related structures, methods of manufacture and design structures20189,932,222Micro-electro-mechanical system (MEMS) structures and design structures20189,926,191'Planar cavity MEMS and related structures, methods of manufacture and design structures'20189,915,784'Optical waveguide structure with waveguide coupler to facilitate off-chip coupling'20189,828,243Planar cavity MEMS and related structures, methods of manufacture and design structures20179,637,373'Planar cavity MEMS and related structures, methods of manufacture and design structures'20179,624,099'Planar cavity MEMS and related structures, methods of manufacture and design structures'20179,604,839'Micro-electro-mechanical system (MEMS) and related actuator bumps, methods of manufacture and design structures'20179,593,007'Method of forming a micro-electro-mechanical system (MEMS) structure'20179,580,298'Micro-electro-mechanical system (MEMS) structures and design structures'20179,406,472'Planar cavity MEMS and related structures, methods of manufacture and design structures'20169,352,954'Planar cavity MEMS and related structures, methods of manufacture and design structures'20169,245,824'Through-vias for wiring layers of semiconductor devices'20169,236,325'Through-vias for wiring layers of semicondutor devices'20169,233,831'Micro-electro-mechanical system (MEMS) structures and design structures'20169,120,667'Micro-electro-mechanical system (MEMS) and related actuator bumps, methods of manufacture and design structures'20159,103,972'Optical waveguide structure with waveguide coupler to facilitate off-chip coupling'20159,059,135'Nanochannel process and structure for bio-detection'20158,987,031'Fabricating a small-scale radiation detector'20158,973,250'Methods of manufacturing a micro-electro-mechanical system (MEMS) structure'20158,956,903'Planar cavity MEMS and related structures, methods of manufacture and design structures'20158,940,570'Micro-electro-mechanical system (MEMS) structures and design structures'20158,901,621'Nanochannel process and structure for bio-detection'20148,865,597'Ta—TaN selective removal process for integrated device fabrication'20148,796,138'Through substrate vias'20148,739,096'Micro-electro-mechanical structure (MEMS) capacitor devices, capacitor trimming thereof and design structures'20148,709,264'Planar cavity MEMS and related structures, methods of manufacture and design structures'20148,692,276'Parallel optical transceiver module'20148,685,778'Planar cavity MEMS and related structures, methods of manufacture and design structures'20148,541,854'Method of minimizing beam bending of MEMS device by reducing the interfacial bonding strength between sacrificial layer and MEMS structure'20138,536,610'Parallel optical transceiver module'20138,448,790'Surface charge enabled nanoporous semi-permeable membrane for desalination'20138,426,316'Ta-TaN selective removal process for integrated device fabrication'20138,399,292'Fabricating a semiconductor chip with backside optical vias'20138,307,994'Surface charge enabled nanoporous semi-permeable membrane for desalination'20128,269,291'Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters'20128,263,492'Through substrate vias'20128,241,957'Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging'20128,163,584'Method of minimizing beam bending of MEMS device by reducing the interfacial bonding strength between sacrificial layer and MEMS structure'20128,029,716'Amorphous nitride release layers for imprint lithography, and method of use'20118,008,095'Methods for fabricating contacts to pillar structures in integrated circuits'20117,943,412'Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters'20117,883,919'Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging'20117,863,070'Methods for encapsulating microelectromechanical (MEM) devices on a wafer scale'20117,808,798'Versatile Si-based packaging with integrated passive components for mmWave applications'20107,738,753'CMOS compatible integrated dielectric optical waveguide coupler and fabrication'20107,581,314'Method of forming noble metal contacts'20097,556,979'Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging'20097,534,696'Multilayer interconnect structure containing air gaps and method for making'20097,518,229'Versatile Si-based packaging with integrated passive components for mmWave applications'20097,422,983'Ta-TaN selective removal process for integrated device fabrication'20087,417,315'Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging'20087,344,907'Apparatus and methods for encapsulating microelectromechanical (MEM) devices on a wafer scale'20087,256,670'Diaphragm activated micro-electromechanical switch'20077,212,091'Micro-electro-mechanical RF switch'20077,202,764'Noble metal contacts for micro-electromechanical switches'20077,192,868'Method of obtaining release-standing micro structures and devices by selective etch removal of protective and sacrificial layer using the same'20077,098,476'Multilayer interconnect structure containing air gaps and method for making'20066,977,569'Lateral microelectromechanical system switch'20056,953,984'Hydrogenated oxidized silicon carbon material'20056,927,472'Fuse structure and method to form the same'20056,924,185'Fuse structure and method to form the same'20056,917,268'Lateral microelectromechanical system switch'20056,876,282'Micro-electro-mechanical RF switch'20056,836,029'Micro-electromechanical switch having a conductive compressible electrode'20046,815,329'Multilayer interconnect structure containing air gaps and method for making'20046,759,321'Stabilization of fluorine-containing low-k dielectrics in a metal/insulator wiring structure by ultraviolet irradiation'20046,758,223'Plasma RIE polymer removal'20046,737,725'Multilevel interconnect structure containing air gaps and method for making'20046,724,086'Hydrogenated oxidized silicon carbon material'20046,720,249'Protective hardmask for producing interconnect structures'20046,682,786'Liquid crystal display cell having liquid crystal molecules in vertical or substantially vertical alignment'20046,639,488'MEMS RF switch with low actuation voltage'20036,577,011'Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same'20036,497,963'Hydrogenated oxidized silicon carbon material'20026,489,857'Multiposition micro electromechanical switch'20026,486,557'Hybrid dielectric structure for improving the stiffness of back end of the line structures'20026,448,655'Stabilization of fluorine-containing low-k dielectrics in a metal/insulator wiring structure by ultraviolet irradiation'20026,448,176'Dual damascene processing for semiconductor chip interconnects'20026,428,894'Tunable and removable plasma deposited antireflective coatings'20026,413,852'Method of forming multilevel interconnect structure containing air gaps including utilizing both sacrificial and placeholder material'20026,380,003'Damascene anti-fuse with slot via'20026,346,747'Method for fabricating a thermally stable diamond-like carbon film as an intralevel or interlevel dielectric in a semiconductor device and device made'20026,346,484'Method for selective extraction of sacrificial place-holding material used in fabrication of air gap-containing interconnect structures'20026,265,779'Method and material for integration of fuorine-containing low-k dielectrics'20016,214,482'Dielectric-layer for magneto-optic storage media structures'20016,197,364'Production of electroless Co(P) with designed coercivity'20016,184,121'Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same'20016,147,009'Hydrogenated oxidized silicon carbon material'20006,140,226'Dual damascene processing for semiconductor chip interconnects'20006,114,937'Integrated circuit spiral inductor'20006,054,329'Method of forming an integrated circuit spiral inductor with ferromagnetic liner'20006,030,904'Stabilization of low-k carbon-based dielectrics'20005,981,000'Method for fabricating a thermally stable diamond-like carbon film'19995,884,990'Integrated circuit inductor'19995,796,166'Tasin oxygen diffusion barrier in multilayer structures'19985,793,272'Integrated circuit toroidal inductor'19985,776,823'Tasin oxygen diffusion barrier in multilayer structures'19985,729,201'Identification tags using amorphous wire'19985,576,579'Tasin oxygen diffusion barrier in multilayer structures'19965,569,506'Magnetic recording disk and disk drive with improved head-disk interface'19965,399,386'In-situ texturing of a thin film magnetic medium'19955,268,072'Etching processes for avoiding edge stress in semiconductor chip solder bumps'19935,134,038'Thin film magnetic recording medium with controlled grain morphology and topology'19925,053,250'Thin film magnetic medium with controlled grain morphology and topology for improved performance'1991

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1991–2021Patents assigned to IBM (126)· patent assignee history
1991–2005Based in Monsey, NY, US· patent location history
2002–2021Based in Upper Saddle River, NJ, US· patent location history
2002–2014Based in Saddle River, NJ, US· patent location history
2012–2016Patents assigned to JAHNES CHRISTOPHER V (11)· patent assignee history
2012–2014Patents assigned to JAHNES CHRISTOPHER VINCENT (5)· patent assignee history
2012–2013Patents assigned to COTTE JOHN M (4)· patent assignee history
2012–2013Based in Yorktown Heights, NY, US· patent location history
2014–2016Patents assigned to STAMPER ANTHONY K (8)· patent assignee history
2019–2021Based in Armonk, NY, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IBM1261991–2021
JAHNES CHRISTOPHER Vself112012–2016
STAMPER ANTHONY K82014–2016
JAHNES CHRISTOPHER VINCENTself52012–2014
COTTE JOHN M42012–2013
Locations
LocationPatentsSpan
Upper Saddle River, New Jersey, US932002–2021
Monsey, New York, US291991–2005
Saddle River, New Jersey, US42002–2014
Armonk, New York, US22019–2021
Yorktown Heights, New York, US22012–2013