Inventor
Wai Keung Ho
Inventor
Tsz Wan Shan, HK
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
H04NPictorial communication, e.g. television17%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation17%
H01LSemiconductor devices8%
H02JElectric power networks8%
PatentTitleYear
9,847,283Semiconductor device with wettable corner leads20177,301,225'Multi-row lead frame'20076,958,261'Optical sensor package'20056,875,635'Method of attaching a die to a substrate'20056,798,074'Method of attaching a die to a substrate'20046,667,543'Optical sensor package'20035,793,123'Electronic device with two power supply modes'1998Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1998Patents assigned to THOMSON MULTIMEDIA SA (1)· patent assignee history
1998Based in Aberdeen, GB· patent location history
2003–2004Patents assigned to MOTOROLA INC (2)· patent assignee history
2003–2005Based in Tsz Wan Shan, HK· patent location history
2005–2007Patents assigned to FREESCALE SEMICONDUCTOR INC (3)· patent assignee history
2007Based in Hong Kong, CN· patent location history
2017Patents assigned to Nexperia BV (1)· patent assignee history
2017Based in Kwai Chung, HK· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FREESCALE SEMICONDUCTOR INC | 3 | 2005–2007 |
| MOTOROLA INC | 2 | 2003–2004 |
| Nexperia BV | 1 | 2017 |
| THOMSON MULTIMEDIA SA | 1 | 1998 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tsz Wan Shan, HK | 4 | 2003–2005 |
| Kwai Chung, HK | 1 | 2017 |
| Hong Kong, CN | 1 | 2007 |
| Aberdeen, GB | 1 | 1998 |