Inventor
Kok Yang Lau
Inventor
Melaka, MY
Overview
Patents· 1 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10100%
PatentTitleYear
6,835,580'Direct chip attach structure and method'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004Patents assigned to SEMICONDUCTOR COMPONENTS IND (1)· patent assignee history
2004Based in Melaka, MY· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SEMICONDUCTOR COMPONENTS IND | 1 | 2004 |
Locations
| Location | Patents | Span |
|---|---|---|
| Melaka, MY | 1 | 2004 |