Inventor
Akio Furusawa
Inventor
Osaka, JP
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Kprimary
B23KSoldering or unsoldering23%
C22CAlloys20%
H05KPrinted circuits16%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
H01LSemiconductor devices7%
Y02PClimate change mitigation technologies in the production or processing of goods7%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form4%
Y10TTechnical subjects covered by former us classification4%
B22FWorking metallic powder1%
H01BCables1%
PatentTitleYear
10,960,496Solder alloy and package structure using same202110,636,724Mount structure202010,493,567Solder alloy and bonded structure using the same201910,170,442Mount structure including two members that are bonded to each other with a bonding material layer having a first interface layer and a second interface layer201910,068,869Mounting structure and BGA ball20189,981,348Solder alloy and mounted structure using same20189,789,569'Solder material and bonded structure'20179,386,699'Mounted structure and manufacturing method of mounted structure'20169,199,340'Solder material and bonded structure'20158,810,035'Semiconductor bonding structure body and manufacturing method of semiconductor bonding structure body'20148,691,377'Semiconductor device'20148,598,464'Soldering material and electronic component assembly'20138,552,307'Mounting structure'20138,421,246'Joint structure and electronic component'20138,338,966'Joint structure, joining material, and method for producing joining material containing bismuth'20128,268,718'Bonded structure and manufacturing method for bonded structure'20128,227,090'Bonding material, electronic component, bonding structure and electronic device'20127,973,412'Semiconductor device using lead-free solder as die bonding material and die bonding material not containing lead'20117,176,402'Method and apparatus for processing electronic parts'20076,428,745'Solder, solder paste and soldering method'20026,267,823'Solder, solder paste and soldering method'20015,962,133'Solder, electronic component mounted by soldering, and electronic circuit board'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2007Based in Katano, JP· patent location history
2011–2014Patents assigned to PANASONIC CORP (9)· patent assignee history
2011–2021Based in Osaka, JP· patent location history
2012–2016Patents assigned to FURUSAWA AKIO (9)· patent assignee history
2012–2014Patents assigned to SAKATANI SHIGEAKI (7)· patent assignee history
2012–2014Patents assigned to NAKAMURA TAICHI (6)· patent assignee history
2015–2021Patents assigned to PANASONIC IP MAN CO LTD (9)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FURUSAWA AKIOself | 9 | 2012–2016 |
| PANASONIC CORP | 9 | 2011–2014 |
| PANASONIC IP MAN CO LTD | 9 | 2015–2021 |
| SAKATANI SHIGEAKI | 7 | 2012–2014 |
| NAKAMURA TAICHI | 6 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Osaka, JP | 18 | 2011–2021 |
| Katano, JP | 4 | 1999–2007 |