Inventor
Tony F. Heinz
Inventor
Chappaqua, NY, US
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1030%
B24BMachines, devices, or processes for grinding or polishing20%
G01NInvestigating or analysing materials by determining their chemical or physical properties19%
G01BMeasuring length, thickness or similar linear dimensions15%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices9%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry2%
C01BNon-metallic elements2%
C07CAcyclic or carbocyclic compounds2%
C23CCoating metallic material2%
PatentTitleYear
10,899,682Catalyst composition comprising modified crystalline aluminosilicate for dehydration20216,072,313'In-situ monitoring and control of conductive films by detecting changes in induced eddy currents'20005,788,801'Real time measurement of etch rate during a chemical etching process'19985,731,697'In-situ monitoring of the change in thickness of films'19985,660,672'In-situ monitoring of conductive films on semiconductor wafers'19975,582,746'Real time measurement of etch rate during a chemical etching process'19965,573,624'Chemical etch monitor for measuring film etching uniformity during a chemical etching process'19965,573,623'Apparatus for contactless real-time in-situ monitoring of a chemical etching process'19965,559,428'In-situ monitoring of the change in thickness of films'19965,516,399'Contactless real-time in-situ monitoring of a chemical etching'19965,501,766'Minimizing overetch during a chemical etching process'19965,500,073'Real time measurement of etch rate during a chemical etching process'19965,489,361'Measuring film etching uniformity during a chemical etching process'19965,480,511'Method for contactless real-time in-situ monitoring of a chemical etching process'19965,456,788'Method and apparatus for contactless real-time in-situ monitoring of a chemical etching process'19955,451,289'Fixture for in-situ noncontact monitoring of wet chemical etching with passive wafer restraint'19955,445,705'Method and apparatus for contactless real-time in-situ monitoring of a chemical etching process'19955,392,124'Method and apparatus for real-time, in-situ endpoint detection and closed loop etch process control'19955,386,121'In situ, non-destructive CVD surface monitor'19955,381,234'Method and apparatus for real-time film surface detection for large area wafers'19955,338,390'Contactless real-time in-situ monitoring of a chemical etching process'19945,294,289'Detection of interfaces with atomic resolution during material processing by optical second harmonic generation'1994Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1994–2000Patents assigned to IBM (21)· patent assignee history
1994–2000Based in Chappaqua, NY, US· patent location history
1995Based in Chappaque, NY, US· patent location history
2021Patents assigned to IFP ENERGIES NOW (1)· patent assignee history
2021Patents assigned to TOTAL REFINING & TECH FELUY (1)· patent assignee history
2021Patents assigned to TOTAL RES & TECHNOLOGY FELUY (1)· patent assignee history
2021Based in Solaize, FR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 21 | 1994–2000 |
| IFP ENERGIES NOW | 1 | 2021 |
| TOTAL REFINING & TECH FELUY | 1 | 2021 |
| TOTAL RES & TECHNOLOGY FELUY | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chappaqua, New York, US | 19 | 1994–2000 |
| Chappaque, New York, US | 2 | 1995 |
| Solaize, FR | 1 | 2021 |