Inventor
Mark Klare
Inventor
Poughkeepsie, NY, US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G01Bprimary
G01BMeasuring length, thickness or similar linear dimensions33%
G01NInvestigating or analysing materials by determining their chemical or physical properties33%
H10DInorganic electric semiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
PatentTitleYear
11,029,148Feed-forward of multi-layer and multi-process information using XPS and XRF technologies202110,648,802Feed-forward of multi-layer and multi-process information using XPS and XRF technologies202010,533,961Method and system for non-destructive metrology of thin layers202010,082,390Feed-forward of multi-layer and multi-process information using XPS and XRF technologies20186,100,189'Second implant for agglomeration control'20005,856,698'Second implanted matrix for agglomeration control and thermal stability'19995,739,064'Second implanted matrix for agglomeration control and thermal stability'1998Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1998–2000Patents assigned to MICRON TECHNOLOGY INC (3)· patent assignee history
1998–2000Based in Boise, ID, US· patent location history
2018–2021Patents assigned to NOVA MEASURING INSTR INC (4)· patent assignee history
2018Patents assigned to REVERA INCORPORATED (1)· patent assignee history
2018–2021Based in Poughkeepsie, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NOVA MEASURING INSTR INC | 4 | 2018–2021 |
| MICRON TECHNOLOGY INC | 3 | 1998–2000 |
| REVERA INCORPORATED | 1 | 2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Poughkeepsie, New York, US | 4 | 2018–2021 |
| Boise, ID, US | 3 | 1998–2000 |