Inventor
GUANPING WU
Inventor
CN
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Bprimary
H10BElectronic memory devices32%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H01LSemiconductor devices29%
H10DInorganic electric semiconductor devices3%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
PatentTitleYear
12,185,550Through array contact structure of three-dimensional memory device202412,137,568Hybrid bonding contact structure of three-dimensional memory device202411,956,953Joint opening structures of three-dimensional memory devices and methods for forming the same202411,785,776Through array contact structure of three-dimensional memory device202311,758,732Hybrid bonding contact structure of three-dimensional memory device202311,728,326Three-dimensional memory device and fabrication method thereof202311,545,505Through array contact structure of three-dimensional memory device202311,527,547Hybrid bonding contact structure of three-dimensional memory device202211,482,532Joint opening structures of three-dimensional memory devices and methods for forming the same202211,437,400Three-dimensional memory device and fabricating method thereof202211,410,983Three-dimensional memory device and fabrication method thereof2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to YANGTZE MEMORY TECH CO LTD (11)· patent assignee history
2022–2024Based in CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| YANGTZE MEMORY TECH CO LTD | 11 | 2022–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| CN | 11 | 2022–2024 |